WMSIC Electronic Components

TE Connectivity 5352033-1

Model5352033-1
PackageThrough-hole, P=2mm
BrandTE CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TE Connectivity 5352033-1
Type
TE CONNECTIVITY
Minimum package
13 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TE CONNECTIVITY
Electronic Component
5352033-1
Electronic Component
1
Package
Through-hole, P=2mm
Electronic Component
7
Electronic Component
and Connector
Electronic Component
0.03g
Electronic Component
2mm
PIN
133P
Electronic Component
1
Electronic Component
BM0258846502
Electronic Component
Through-hole
Operating Temperature
55℃~+125℃
Electronic Component
Electronic Component
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TE Connectivity 型号 5352033-1 产品概述

一、产品简介

5352033-1 属于 TE Connectivity Z‑PACK 2.00 mm 系列的 Hard Metric 背板连接器(PCB Mount Header,Mezzanine),为板对板堆叠设计的高密度通用接口。该件为 19 列 × 7 排共 133 个触点的布局,中心距 2.00 mm(0.078 in),支持 ≤1 Gb/s 的信号速率,适用于中等速率数字与混合信号系统。

二、主要电气与机械参数

  • 接触位数:133P(19 列 × 7 排)
  • 排数:7 排
  • 额定电流:1.5 A(每触点)
  • 触头镀层:金(提升接触可靠性与抗氧化性能)
  • 中心距:2.00 mm(标准 Z‑PACK 2mm HM)
  • 传输速率:≤1 Gb/s(典型应用)
  • 工作温度范围:-55 ℃ ~ +125 ℃
  • 封装形式:PCB 安装(具体焊接方式与封装图请参照厂方资料)
  • 品牌:TE Connectivity(美国泰科)

三、产品特点与优势

  • 高密度:2.00 mm 间距实现更紧凑的板间连接,节省电路板空间。
  • 接触可靠:金镀层触头降低接触电阻并增强长期可靠性,适应恶劣环境。
  • 宽温度范围:-55℃ 至 +125℃,适合工业级和通信设备的温度要求。
  • 通用性强:Mezzanine 形式便于板对板堆叠,用于背板与模块之间的互联。
  • 中低速信号适配:支持 ≤1 Gb/s,可满足以太网、控制总线及多种串行接口需求。

四、典型应用场景

  • 网络与通信设备背板互联(交换机、路由器、聚合器)
  • 服务器与存储系统的模块化连接
  • 工业控制与自动化设备的板间信号/电源传输
  • 测试与测量仪器的可插拔模块接口

五、安装与使用建议

  • 请依据 TE 官方资料确认 PCB 封装尺寸与焊盘布局,确保与 5352033-1 的机械配合。
  • 在焊接与返修时遵循推荐的温度曲线与工艺指南,避免对塑料件与镀层产生损伤。
  • 设计时考虑机械支撑与应力分散,减少反复插拔或震动对连接稳定性的影响。
  • 对于关键应用,建议查阅厂方数据手册以获取接触电阻、耐久性(插拔次数)等详细规范并进行可靠性验证。

六、结论

5352033-1 以其 2.00 mm 高密度布局、金镀触头及宽温度范围,适用于需要可靠板对板互连的中速应用场景。选用前建议参考 TE Connectivity 的完整数据手册和机械图纸,结合实际电流、信号完整性及机械强度要求进行评估与验证。若需型号替代、配对对接件或具体图纸,可进一步获取厂商资料或联系代理商。

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