Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TE Connectivity FSMSMTR
Configuration
1 options
Configuration
22+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TE Connectivity FSMSMTR
- Type
- TE CONNECTIVITY
- Unit
- Electronic Component
- Minimum package
- 1800 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TE CONNECTIVITY
- Electronic Component
- FSMSMTR
- Electronic Component
- 1
- Package
- SMD,6x3.5mm
- Electronic Component
- Switch
- Electronic Component
- 0.643g
- Electronic Component
- 1.8N
- Electronic Component
- 1
- Electronic Component
- BM0227540137
- Electronic Component
- Electronic Component
- Electronic Component
- 2
- Operating Temperature
- 35℃~+85℃
- Switch
- 3.5mm
- Switch
- 6mm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FSMSMTR 轻触开关（TE Connectivity）产品概述
一、产品简介
FSMSMTR 系列为 TE Connectivity 出品的小型贴片轻触开关，单刀单掷常开（SPST-NO）结构，圆形按键设计。器件为表面贴装封装（SMD），外形尺寸约 6 × 3.5 mm，采用鸥翼型引脚，便于回流焊与自动贴装。额定工作电压 24 V，触点电流 0.05 A（50 mA），操作力约 1.8 N，工作温度范围 -35 °C 至 +85 °C，适用于对体积和可靠性有较高要求的电子产品。
二、主要技术参数
- 电路结构：单刀单掷（常开，SPST-NO）
- 按钮形状：圆形按钮
- 作用力：1.8 N（约）
- 安装方式：立贴（SMD）
- 触点电流：0.05 A（50 mA）
- 额定电压：24 V
- 引脚样式：鸥翼型（Gull-wing）
- 工作温度：-35 °C ~ +85 °C
- 封装尺寸：6 × 3.5 mm（SMD）
三、机械与封装特性
鸥翼引脚配合立贴封装，适合自动化贴片与回流焊工艺，开关体积小、厚度低，利于厚度受限的终端设备设计。圆形按键提供明确的触感反馈，操作力 1.8 N 平衡了误触防护与手感舒适性。封装尺寸和引脚形式有利于标准化 PCB 布局与产线加工。
四、典型应用场景
适用于便携消费电子、遥控器与输入面板、智能家居控制、工业控制面板、轻量级医疗设备、物联网终端及其它需要微小按键输入的场合。特别适合对空间、重量以及自动化装配有严格要求的产品。
五、可靠性与环境注意事项
该开关适应 -35 °C 至 +85 °C 的工作环境，但在设计时仍建议结合具体应用进行老化、耐久和接触电阻测试。回流焊温度曲线、清洗溶剂和外力作用均可能影响寿命及接触可靠性，应参照 TE Connectivity 官方资料和 PCB 工艺规范进行评估。
六、安装与使用建议
为保证良好焊接与可靠性，建议采用厂家给定的 PCB 焊盘尺寸与回流焊工艺，使用适配的贴装参数和夹具以避免焊接位移。避免在按键受力方向施加过大或持续外力，以延长机械寿命。对关键产品，建议进行样机验证与环境应力测试。
七、采购与资料
FSMSMTR 由 TE Connectivity（美国泰科）提供，建议在采购前索取并参阅完整数据手册与物料表（包括回流曲线、焊盘建议、寿命试验数据等），并与供货商确认包装、可追溯性与长期供货能力。若需替代件，可根据尺寸、触点容量与作用力匹配同类 SMD 轻触开关进行对比选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
