WMSIC Electronic Components

TAI-TECH HCB1608KF-331T20 HCB1608KF

ModelHCB1608KF-331T20
Package0603
BrandTAI-TECH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TAI-TECH HCB1608KF-331T20
Type
TAI-TECH
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TAI-TECH
Electronic Component
HCB1608KF-331T20
Electronic Component
1
Package
0603
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.036g
Electronic Component
1
Channel Count
1
Electronic Component
BM0264880411
Current
2A
@Frequency
330Ω@100MHz
Resistor(DCR)
100mΩ
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HCB1608KF-331T20 产品概述

一、产品简介

HCB1608KF-331T20 为 TAI-TECH(台庆)品牌的商规型多用途磁珠器件,采用 0603(1608 公制)贴片封装,单通道设计,针对高频干扰抑制优化。器件在 100MHz 频率下标称阻抗为 330Ω,允差 ±25%,直流电阻低至 100mΩ,额定电流 2A,适合中低功率电子产品中的电源和信号线 EMI 抑制应用。

二、主要参数

  • 品牌:TAI-TECH(台庆)
  • 型号:HCB1608KF-331T20
  • 封装:0603(1608)表面贴装
  • 阻抗:330Ω @ 100MHz(±25%)
  • 直流电阻(DCR):100 mΩ
  • 额定电流:2 A
  • 通道数:1(单通道)
  • 等级:商规(商用可靠性)

三、性能特点

  • 高频抑制能力强:在 100MHz 附近提供较高阻抗,有效抑制开关电源、数字电路产生的开关噪声与电磁干扰。
  • 低直流电阻:100 mΩ 的 DCR 带来较小的压降与功耗,适合需要较大电流传输且又需滤波的电源轨。
  • 紧凑封装:0603 小体积利于空间受限的移动设备、便携模块与高密度电路板布局。
  • 兼容常规回流工艺:适应主流 SMT 回流焊工艺,便于大规模生产与装配。

四、典型应用

  • 开关电源输入/输出滤波(DC-DC、LDO 输出侧噪声抑制)
  • 智能手机、平板、可穿戴设备的电源与信号线 EMI 抑制
  • USB、HDMI、相机模块等接口的共模/差模噪声抑制(串联放置)
  • 工业控制与通信设备中对高频干扰的局部抑制

五、封装与可靠性

  • 0603 小外形便于高密度布板,常用纸带卷盘(Tape & Reel)方式供货,适配自动贴片机。
  • 商规等级适用于消费电子与一般工业类产品,对温湿度和机械应力有常规认证与测试支持。器件材料符合主流环保规范(如 RoHS)时,应视具体供货批次确认。

六、使用建议与注意事项

  • 布局建议:将磁珠尽量靠近噪声源或接收端放置,串联于电源或信号线中,配合去耦电容形成低通或 π 型滤波网络以获得更好抑制效果。
  • 电流与发热:在接近额定电流 2A 时注意器件自热与环境温度对阻抗及寿命的影响,必要时做热仿真或实测验证。
  • 回流焊:兼容标准回流焊,但应避免超过过高的峰值温度与超长暴露时间,具体焊接曲线按厂家推荐的回流方案调整。
  • 参数确认:阻抗随频率变化显著,项目设计时宜参考器件的阻抗-频率曲线(若有)并在目标频段内验证实际性能。

总结:HCB1608KF-331T20 以其 330Ω@100MHz 的高频抑制能力、低 DCR 和小型封装,适用于对电源或信号线高频干扰敏感的各类消费电子与一般工业设备,是一款兼顾滤波性能与电流承载能力的通用型磁珠选择。若需更详细的阻抗曲线、温升数据或可靠性报告,建议向供货商索取完整数据手册。

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