WMSIC Electronic Components

TAI-TECH HCB1608KF-101T30 HCB1608KF

ModelHCB1608KF-101T30
Package0603
BrandTAI-TECH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TAI-TECH HCB1608KF-101T30
Type
TAI-TECH
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TAI-TECH
Electronic Component
HCB1608KF-101T30
Electronic Component
1
Package
0603
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.036g
Electronic Component
1
Channel Count
1
Electronic Component
BM69418478
Operating Temperature
40℃~+125℃
Current
3A
@Frequency
100Ω@100MHz
Resistor(DCR)
40mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:HCB1608KF-101T30 磁珠

一、产品简介

HCB1608KF-101T30 是一款来自知名品牌 TAI-TECH(台庆)的高性能磁珠,封装形式为0603(宽度0.06英寸,长度0.03英寸),是电路设计中常用的表面贴装元器件之一。其主要功能是作为干扰抑制器,通过提供高阻抗来有效地过滤高频噪声,确保信号的稳定性和可靠性。

二、关键规格

  1. 阻抗值:该磁珠在100MHz时的阻抗为100Ω,可有效抑制频率为100MHz附近的高频噪声。
  2. 直流电阻(DCR):40mΩ的直流电阻值意味着其在通过电流时会产生极小的功耗,适用于对能量效率有较高要求的应用场景。
  3. 额定电流:其额定电流为3A,适合承载较大的电流,能够满足大多数现代电子设备的需求。
  4. 公差:±25%的公差范围允许设计人员在选型时有更大的灵活性,能够轻松适用于多种不同的电路设计。

三、应用领域

HCB1608KF-101T30 磁珠主要应用于以下几个领域:

  1. 消费电子:在智能手机、平板电脑、笔记本电脑以及其他便携设备中使用,帮助消除高频噪声对音频和视频信号的干扰。

  2. 通讯设备:在无线通讯设备和网络设备中,帮助提高信号的清晰度,确保数据传输的完整性。

  3. 家电产品:在洗衣机、微波炉和冰箱等家用电器中,减少电磁干扰对设备正常工作的影响,确保用户安全。

四、设计注意事项

在设计电路时,需注意以下事项:

  1. 安装位置:磁珠应尽量靠近需要滤波的元件(如IC),确保高频噪声能有效被过滤。
  2. 选择合适的阻抗与电流:根据具体应用需求,选择适当的磁珠,以防超出其额定电流或影响屏蔽效果。
  3. 引脚布局:在PCB设计中,合理布局磁珠与后续元件的引脚,确保信号完整性。

五、竞争优势

  1. 高性能:HCB1608KF-101T30磁珠能够在宽频带内实现高效的噪声抑制,特别是在面临复杂电磁环境的应用中,具备优势。
  2. 小型封装:0603的封装尺寸能够有效节省PCB空间,非常适合对体积和重量要求严格的产品。
  3. 可靠性:作为知名品牌的产品,TAI-TECH提供的质量保证使其在市场中赢得了良好的声誉。

六、总结

HCB1608KF-101T30 磁珠凭借其出色的电气性能和适用的封装尺寸,适合广泛的电子应用。无论是在消费电子、通讯设备还是家电产品中,它都能有效地提升产品性能,降低电磁干扰。通过采用这一高性能组件,设计师能够更好地应对现代电子产品日益严格的技术需求,确保信号的清晰与稳定,提升最终产品的市场竞争力。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.