Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品名称:WCM2012F2SF-261T03
品牌:TAI-TECH(台庆)
类型:共模滤波器
封装:SMD(表面贴装)
电压规格:80V(最大额定电压)
额定电流:300mA
尺寸:2.0mm x 1.2mm x 1.2mm
WCM2012F2SF-261T03是一款高性能的共模滤波器,专为提高电子设备中的信噪比而设计。其小巧的SMD封装使其非常适合空间有限的应用场合,而其优秀的电气性能则确保了在各种条件下的稳定工作。该滤波器能够有效过滤共模噪声,从而保护下游电路,确保信号的清晰传输。
该共模滤波器广泛应用于以下领域:
通信设备:在各种通信设备中,如手机、无线电、数据传输模块等,WCM2012F2SF-261T03可显著减少信号干扰,保证通信质量。
工业控制:在自动化控制系统和工厂设备中,保证信号的稳定性和可靠性,是实现高效控制的基础。
消费电子:适用于电视机、音响等消费电子产品,降低电源噪声和外部干扰,以提升用户体验。
汽车电子:在现代汽车的电子系统中,包括车载电脑、音响系统等,用于提高信号质量和系统可靠性。
电压和电流:WCM2012F2SF-261T03的最大额定电压为80V,额定电流为300mA,足以应对大多数应用场合下的电流负载要求。
尺寸与封装:其小巧的2.0mm x 1.2mm x 1.2mm封装设计为现代电子产品的紧凑设计提供了解决方案,极大地节省了PCB板的空间,有利于更紧凑的产品设计。
共模抑制效应:该滤波器在工作过程中能够显著降低共模干扰,有效地阻止环境噪声的干扰,提升了设备的可靠性与使用寿命。
高频性能:WCM2012F2SF-261T03具备良好的高频性能,使其能够处理高频信号,适用于高频应用场景,提高了信号传输能力。
高效能抑噪:其设计使得共模信号和输出信号之间的干扰降至最低,满足高要求应用的需求。
可靠性:TAI-TECH(台庆)作为知名电子元器件制造商,确保了产品在质量、性能方面的可靠性,经过严格的测试和验证,适合各种恶劣环境使用。
灵活应用:其小巧的封装与优异的电气性能,大大增加了在不同设备中的应用灵活性,适合不同的设计需求。
可持续性:作为表面贴装元件,WCM2012F2SF-261T03适配现代自动化生产流程,确保生产效率及品质稳定。
WCM2012F2SF-261T03共模滤波器不仅在电气性能上出色,其小巧的外形和高效能的特性使其成为现代电子设计的理想选择。通过采用这款滤波器,设计师能够有效提升产品的信号质量,降低电磁干扰,从而满足市场对高性能电子设备日益增长的需求。无论是在通信、工业、消费电子还是汽车领域,WCM2012F2SF-261T03都能够为您的设计提供可靠的电气保障,助力您在竞争激烈的市场环境中站稳脚跟。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products