Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TAI-TECH TMPC0502HP-1R0MG-D TMPC0502HP
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TAI-TECH TMPC0502HP-1R0MG-D
- Type
- TAI-TECH
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TAI-TECH
- Electronic Component
- TMPC0502HP-1R0MG-D
- Electronic Component
- 1
- Package
- SMD,5.7x5.2mm
- Electronic Component
- Power Inductor
- Electronic Component
- ±20%
- Electronic Component
- 0.37g
- Inductor
- 1uH
- Electronic Component
- 1
- Electronic Component
- BM69418472
- Current
- 7A
- Resistor(DCR)
- 17.5mΩ
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- and Current(Isat)
- 13.7A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TMPC0502HP-1R0MG-D 产品概述
一、基本信息
TMPC0502HP-1R0MG-D 是一款由知名品牌 TAI-TECH（台庆）生产的高性能功率电感，专为表面安装（SMD）应用设计。其具有低电阻、高电流承载能力、紧凑的封装和优异的温度特性，适合多种电子产品中的电源管理以及滤波电路等应用。
二、产品规格
- 电感值：1µH
- 直流电阻（DCR）：17.5mΩ
- 额定电流：7A
- 公差：±20%
- 封装类型：SMD（表面贴装技术）
三、技术特性
低直流电阻（DCR）： TMPC0502HP-1R0MG-D 的 17.5mΩ 直流电阻确保在高频和高电流工作情况下的能量损耗极少，这在电力转换及高负载条件下显得尤为重要，有助于提高系统的整体效率。
高电流承载能力： 额定电流达到 7A，使得该电感能够满足许多高功率应用的需求，减少由于过载引起的温升及潜在的组件损坏风险，确保系统的稳定性与可靠性。
小型化封装： 采用 SMD 封装设计，TMPC0502HP-1R0MG-D 的体积较小，适合空间受限的电子设备。表面贴装的特性使得安装更加简便，能够减少PCB上的占用面积，提高整体设计的紧凑性。
宽温度范围： TMPC0502HP-1R0MG-D 具备良好的热特性，能在多种工作环境下保持稳定性能。这使其广泛应用于消费电子、通信设备及工业控制等领域。
四、应用场景
TMPC0502HP-1R0MG-D 的特性使其非常适合以下应用：
DC-DC 变换器： 在开关电源与降压转换器中，TMPC0502HP-1R0MG-D 可用作能量存储元件，支持高效的电能转换过程。
滤波器： 该电感可集成于各种滤波应用中，帮助减少电流波动，提高电源质量，保护后级电路。
电池管理系统： 在电池管理和充电系统中，使用 TMPC0502HP-1R0MG-D 可以提升电池充放电效率和安全性。
通信设备： 适用于各类通信设备的电源模块，有助于改进电源质量，提升信号完整性。
工业自动化设备： 在各种工业自动化产品中，TMPC0502HP-1R0MG-D 可用于电流传感器、电动机驱动器等模块。
五、总结
TMPC0502HP-1R0MG-D 是一款高效、低损耗的功率电感，充分展示了现代电子设计对元件小型化、高效能和可靠性的需求。作为一种集成化与高性能于一体的电感产品，TMPC0502HP-1R0MG-D 在多种电子和电力应用中均表现出色。无论是在消费电子、电源管理还是工业控制等领域，这款电感的稳健性能都能满足严苛的使用需求，助力设计工程师打造出更高效、稳定的电子产品。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
