WMSIC Electronic Components

TAI-TECH HCB3216KF-121T50 HCB3216KF

ModelHCB3216KF-121T50
Package1206
BrandTAI-TECH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TAI-TECH HCB3216KF-121T50
Type
TAI-TECH
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TAI-TECH
Electronic Component
HCB3216KF-121T50
Electronic Component
1
Package
1206
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
1.278g
Electronic Component
1
Channel Count
1
Electronic Component
BM0264973386
Current
5A
@Frequency
120Ω@100MHz
Resistor(DCR)
20mΩ
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HCB3216KF-121T50 产品概述

1. 产品简介

HCB3216KF-121T50 是一款由 TAI-TECH(台庆)公司生产的高性能磁珠,属于电子元器件中的磁性元件类别。该磁珠采用 1206 封装,广泛应用于各种电子设备中,主要用于抑制高频噪声和电磁干扰(EMI),确保电路的稳定性和可靠性。

2. 主要参数

  • 商品分类: 磁珠
  • 标称阻抗@测试频率: 120Ω @ 100MHz
  • 电路数: 1
  • 直流电阻 (RDC): 20mΩ
  • 误差: ±25%
  • 额定电流: 5A
  • 封装: 1206

3. 产品特点

  • 高频噪声抑制: HCB3216KF-121T50 在 100MHz 频率下具有 120Ω 的标称阻抗,能够有效抑制高频噪声,减少电磁干扰,提升电路的信号完整性。
  • 低直流电阻: 该磁珠的直流电阻仅为 20mΩ,确保在通过大电流时不会产生显著的电压降,从而保持电路的高效运行。
  • 高额定电流: 额定电流为 5A,适用于高电流应用场景,如电源管理、电机控制等。
  • 紧凑封装: 采用 1206 封装,尺寸小巧,便于在紧凑的电路板上进行布局和安装,特别适合空间受限的设计。
  • 宽误差范围: 误差范围为 ±25%,提供了较大的设计灵活性,适应不同的应用需求。

4. 应用领域

HCB3216KF-121T50 广泛应用于各种电子设备中,包括但不限于:

  • 电源管理: 用于开关电源、DC-DC 转换器等,抑制高频噪声,提高电源的稳定性和效率。
  • 通信设备: 在无线通信设备、基站、路由器等中,减少电磁干扰,确保信号的清晰传输。
  • 消费电子: 应用于智能手机、平板电脑、笔记本电脑等,提升设备的电磁兼容性(EMC)。
  • 工业控制: 在工业自动化设备、电机控制器等中,抑制噪声,提高系统的可靠性和稳定性。
  • 汽车电子: 用于汽车电子控制系统、车载娱乐系统等,确保在恶劣环境下的稳定运行。

5. 技术优势

  • 高性能材料: 采用高品质的磁性材料,确保在高频下具有优异的噪声抑制性能。
  • 可靠性高: 经过严格的质量控制和测试,确保在各种应用场景下的长期稳定性和可靠性。
  • 易于集成: 1206 封装设计,便于自动化生产线的贴装和焊接,提高生产效率。

6. 使用注意事项

  • 温度范围: 在使用时需注意磁珠的工作温度范围,避免超出其额定温度,以免影响性能和寿命。
  • 电流限制: 确保通过磁珠的电流不超过其额定电流,以防止过热和损坏。
  • 布局设计: 在电路板布局时,应尽量减少磁珠与其他元器件的距离,以降低噪声和干扰。

7. 结论

HCB3216KF-121T50 是一款高性能的磁珠,具有优异的噪声抑制能力和高额定电流,适用于多种电子设备中的高频噪声和电磁干扰抑制。其紧凑的 1206 封装和低直流电阻设计,使其成为电源管理、通信设备、消费电子、工业控制和汽车电子等领域的理想选择。TAI-TECH(台庆)公司凭借其先进的技术和严格的质量控制,确保了该产品的高可靠性和长期稳定性,是工程师和设计师在电路设计中的优选元件。

通过以上概述,可以看出 HCB3216KF-121T50 在电子元器件中的重要地位和广泛应用,其卓越的性能和可靠性将为各种电子设备提供强有力的支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.