WMSIC Electronic Components

TAI-TECH DFP252012TF-4R7M DFP252012TF

ModelDFP252012TF-4R7M
Package1008
BrandTAI-TECH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TAI-TECH DFP252012TF-4R7M
Type
TAI-TECH
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TAI-TECH
Electronic Component
DFP252012TF-4R7M
Electronic Component
1
Package
1008
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.065g
Inductor
4.7uH
Electronic Component
1
Electronic Component
BM0265420034
Current
1.5A
Resistor(DCR)
230mΩ
Electronic Component
Electronic Component
Electronic Component
2000
and Current(Isat)
1.6A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DFP252012TF-4R7M 功率电感产品概述

一、产品基本信息

DFP252012TF-4R7M是台庆电子(TAI-TECH)推出的贴片式功率电感,专为中小功率电子设备的电源管理、信号滤波场景设计。产品型号中:

  • “252012”对应封装尺寸(长×宽×高:2.5mm×2.0mm×1.2mm);
  • “4R7”代表标称电感值4.7μH(微亨);
  • “M”标识精度±20%;
    核心参数清晰明确,适配多数便携式及小型电子设备的性能需求。

二、核心性能参数详解

1. 电感值与精度

标称电感值4.7μH,精度±20%(实际范围3.76μH~5.64μH)。该精度覆盖常规功率电路的设计余量,无需额外补偿电路,降低系统设计难度。

2. 电流特性

  • 额定电流(Irms):1.5A(连续工作最大允许电流,超此值会加剧发热、衰减性能);
  • 饱和电流(Isat):1.6A(电感值下降10%时的极限电流,长期超此值会影响稳压/滤波效果)。

3. 直流电阻(DCR)

230mΩ(毫欧),直接影响功耗(P=I²×DCR)。以1.5A额定电流计算,功耗约0.52W,在小尺寸电感中属于合理范围,有效控制发热。

4. 封装与耐温

贴片式(SMD)封装,兼容常规回流焊工艺;工作温度范围-40℃~+125℃,适应工业及消费电子环境。

三、适用应用场景

DFP252012TF-4R7M的小尺寸、中等电流能力,适配以下场景:

  1. 便携式电子设备:智能手机、平板、智能手环、蓝牙耳机的电池管理系统(BMS)、DC-DC降压模块,小封装适配紧凑PCB布局;
  2. LED驱动电路:手机闪光灯、智能手表指示灯等小功率LED恒流驱动,稳定滤波保证亮度均匀;
  3. 汽车电子辅助电路:车载USB充电口、仪表盘背光,耐温特性适应车载温度变化;
  4. 小型工业模块:PLC输入输出模块、传感器供电电路,实现电源滤波与EMI抑制。

四、产品优势与特点

1. 小尺寸高密度布局

2.5×2.0×1.2mm封装比常规功率电感体积缩小约30%,适配高密度PCB设计,降低设备整体尺寸。

2. 性能稳定一致性好

台庆自动化生产工艺保证参数一致性,批量应用时减少电路调试工作量。

3. 电流与功耗平衡

1.5A额定电流+230mΩ DCR,兼顾电流能力与功耗控制,避免发热导致的性能衰减。

4. 兼容性强

贴片封装兼容常规SMT生产线,无需特殊焊接设备,降低制造成本。

五、使用注意事项

  1. 电流限制:连续电流≤1.5A,峰值电流≤1.6A,避免电感饱和;
  2. 温度控制:环境温度-40℃~+125℃,高温场景预留散热空间;
  3. 焊接工艺:回流焊峰值温度≤245℃,回流时间≤30秒,避免过热损坏磁芯;
  4. 布局设计:电感靠近电源输入/输出端,减少线路寄生电感,提升效率。

该产品以小尺寸、稳定性能适配中小功率场景,是便携式设备、汽车电子等领域的实用选择。

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