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TAI-TECH TMPA1265SP-100MN-D TMPA1265SP
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TAI-TECH TMPA1265SP-100MN-D
- Type
- TAI-TECH
- Minimum package
- 500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TAI-TECH
- Electronic Component
- TMPA1265SP-100MN-D
- Electronic Component
- 1
- Package
- SMD,12.6x13.5mm
- Electronic Component
- Power Inductor
- Electronic Component
- ±20%
- Electronic Component
- 6.428g
- Inductor
- 10uH
- Electronic Component
- 1
- Electronic Component
- BM0264880407
- Current
- 13A
- Resistor(DCR)
- 13mΩ
- Electronic Component
- Electronic Component
- Electronic Component
- 500
- and Current(Isat)
- 17A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TMPA1265SP-100MN-D 产品概述
一、产品简介
TMPA1265SP-100MN-D 是 TAI-TECH（台庆）推出的一款功率型贴片电感，标称电感值 10 μH，封装为 SMD，外形尺寸 12.6 × 13.5 mm。该器件专为中大电流开关电源与功率滤波场景设计，具备较高的额定电流与饱和电流能力，适配空间受限且要求高电流承载的板级电源应用。
二、主要性能参数
- 电感值：10 μH（公差 ±20%）
- 额定电流（Irated）：13 A（在规定温升条件下的持续工作电流）
- 饱和电流（Isat）：17 A（超过此电流电感量将显著下降）
- 直流电阻（DCR）：约 13 mΩ
- 封装：SMD，外形尺寸 12.6 × 13.5 mm
- 品牌：TAI-TECH（台庆）
三、产品特点
- 高电流承载：额定 13 A、饱和 17 A，适合高功率密度转换器与电源滤波。
- 低 DCR：约 13 mΩ，可降低直流损耗，提升效率（注意 I^2·R 损耗随电流平方增长）。
- 标准化 SMD 封装：方便自动贴装与回流焊接，利于量产。
- 稳定性与可靠性：在额定条件下可长期工作，适配汽车电子、电源管理等对可靠性有要求的应用（具体可靠性需参照厂商数据）。
四、典型应用场景
- DC-DC 降压/升压转换器（中大功率）
- 电源输入滤波与输出滤波（开关电源、LED 驱动）
- 汽车电子电源模块（满足高电流传输需求时需关注温升与耐振动）
- 工业电源与通讯设备中的电磁干扰抑制与能量储存
五、选型与设计建议
- 电流裕量：尽量使工作电流低于额定电流以减少温升与损耗，工程上常保留 20%～30% 余量；高峰值短时通过可接近 Isat，但应避免长期工作在接近饱和区。
- 损耗评估：按 I^2·DCR 估算直流损耗，例如在 13 A 时（近额定电流），直流损耗约为 13^2 × 0.013 ≈ 2.2 W，需在热设计中考虑散热。
- 电感下降：注意 ±20% 公差与电流导致的电感变化，对环路设计（反馈补偿）进行仿真验证。
- 布局与散热：尽量靠近开关元件放置，拓宽引脚铜箔并在底板做热铜层或通孔散热，减少寄生电感与热阻。
六、焊接与存储注意事项
- 推荐采用符合电子行业标准的无铅回流焊曲线；避免手工过烧或冷焊导致机械损伤。
- 贴装时防止外力挤压元件端面，避免引脚受力导致内部结构破坏。
- 存储于干燥环境，防潮包装打开后按厂商建议回潮烘烤处理再焊接。
七、质量与可靠性
- 在关键应用（如汽车、医疗）采用前，建议获取并评审厂商的可靠性报告（温度循环、湿热、振动、寿命测试等）与样品作真实工况验证。
- 对于高温或高电流工况，进行 PCB 级热仿真与实际温升测试，确保长期稳定工作。
如需详细的电感频率特性曲线、温升曲线或封装三维图纸，请联系 TAI-TECH（台庆）或授权分销商获取完整数据手册与样品以便验证设计。
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