WMSIC Electronic Components

TAI-TECH TMPC1205HP-3R3MG-D TMPC1205HP

ModelTMPC1205HP-3R3MG-D
PackageSMD
BrandTAI-TECH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TAI-TECH TMPC1205HP-3R3MG-D
Type
TAI-TECH
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TAI-TECH
Electronic Component
TMPC1205HP-3R3MG-D
Electronic Component
1
Package
SMD
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
4.72g
Inductor
3.3uH
Electronic Component
1
Electronic Component
BM0264880416
Current
15A
Resistor(DCR)
6.8mΩ
Electronic Component
Electronic Component
Electronic Component
500
and Current(Isat)
32A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMPC1205HP-3R3MG-D 产品概述

一、产品概述

TMPC1205HP-3R3MG-D 为 TAI-TECH(台庆)推出的一款高电流贴片功率电感,额定电感值为 3.3 µH(公差 ±20%),直流电阻(DCR)仅 6.8 mΩ,额定电流 15 A,饱和电流(Isat)可达 32 A。该器件采用 SMD 封装,适合高密度板级电源设计,用于开关电源滤波、储能与瞬态电流支撑等关键电源环节。

二、主要参数

  • 品牌:TAI-TECH(台庆)
  • 型号:TMPC1205HP-3R3MG-D
  • 电感值:3.3 µH ±20%
  • 额定电流:15 A(连续工作电流)
  • 饱和电流(Isat):32 A(磁芯进入饱和前的参考电流)
  • 直流电阻(DCR):6.8 mΩ
  • 封装形式:SMD(贴片)

三、性能特点

  • 低直流电阻:6.8 mΩ 有效降低铜损和功耗,提高整体转换效率。
  • 高电流承载能力:15 A 额定电流结合 32 A 的饱和电流裕量,能应对较大的瞬态电流和冲击负载。
  • 稳定的电感特性:在常见工作点下保持良好滤波与储能效果,适配多种开关频率范围。
  • SMD 封装:利于自动化贴装与回流焊工艺,便于高密度布板和可靠性要求高的产品设计。

四、典型应用场景

  • DC-DC 降压(Buck)转换器输出滤波或储能电感
  • 高电流电源模块与电源管理单元(PMU)
  • 服务器、通信设备与电信基站电源滤波
  • 汽车电子供电系统(符合电源抗扰与冲击要求的设计)
  • LED 驱动、电池管理与便携式大电流负载电源

五、设计与布局建议

  • 布局靠近开关器件与电感输入/输出端,尽量缩短高频回路环路面积以减少 EMI。
  • 采用多过孔(vias)并联增强散热,从而提高电感的持续载流能力和热稳定性。
  • 在额定电流附近工作时建议留有安全裕量(通常 20%~30% 的电流余量),以避免长期温升和磁芯接近饱和。
  • 与电容、MOSFET 等元件配合时,注意环路阻抗匹配与滤波效率优化,必要时做电路仿真或测试验证。

六、注意事项与可靠性

  • 焊接工艺应采用推荐的回流曲线,避免超温或长时间高温导致封装与磁芯特性变化。
  • 存储与搬运时建议防潮包装与避免机械冲击。
  • 在高温或高湿环境下使用时,应考虑温升对直流电阻与电感值的影响,必要时进行温度循环和老化测试验证。
  • 选型时需根据实际工作频率、纹波电流与允许温升综合评估,确保电感在目标工况下既不过热也不过饱和。

TMPC1205HP-3R3MG-D 以其低 DCR、高电流承载能力与贴片封装优势,适合对效率和空间有较高要求的中高功率电源设计,是降低损耗、提升系统稳定性的可靠选择。若需样品、详细封装尺寸或频率特性曲线,请联系供应商或查阅产品数据手册。

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