WMSIC Electronic Components

Taiwan Lu Hai MSMD150-33V MSMD150

ModelMSMD150-33V
Package1812
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MSMD150-33V
Type
Taiwan Luhai
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MSMD150-33V
Electronic Component
1
Electronic Component
3.41mm
Package
1812
Electronic Component
Resettable Fuse
Electronic Component
0.113g
Electronic Component
4.73mm
Electronic Component
0.6mm
Electronic Component
1
Electronic Component
500ms
Electronic Component
BM0264399018
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
33V
Power(Pd)
800mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MSMD150-33V 产品概述

一、概述

MSMD150-33V 是台湾陆海(Lu Hai)推出的一款高可靠性自恢复保险元件(聚合物正温度系数热敏熔断器,PPTC),封装为标准 1812(尺寸 4.73mm × 3.41mm × 0.6mm)。器件针对 33V 以下直流系统的过流保护设计,具有快速的热响应与低的初始阻抗,适合用于消费电子、通信、电源模块与车载辅助电路等需要多次自动恢复保护的场合。

主要基础参数(典型/最大值):

  • 耐压 Vmax:33 V
  • 最大电流 Imax:100 A(短时)
  • 保持电流 Ihold:1.5 A
  • 跳闸电流 Itrip:3 A
  • 功耗 Pd:800 mW(标称)
  • 初始态阻值 Rmin:40 mΩ
  • 跳断后阻值 R1max:160 mΩ
  • 动作时间:500 ms(典型条件下)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装:1812(尺寸如上)

二、主要特点

  • 低初始电阻(Rmin≈40 mΩ),在正常工作时压降小、发热低。
  • 明确的保持/跳闸电流(1.5 A / 3 A),便于电路可靠选型。
  • 自恢复特性:过流后自动限流并在故障消除后恢复,免去更换熔丝的维护。
  • 封装 1812,便于自动贴装并兼容常见 PCB 布局。
  • 宽温度范围,适应工业及车辆环境。

三、典型应用场景

  • USB/数据接口、充电电源的过流保护。
  • 电源模块输出侧、稳压器保护。
  • 通信设备与路由器的电源输入保护。
  • 智能家电、小型电机驱动的短路/过载保护(配合限流设计)。

四、设计与选型注意点

  • 确认系统最大工作电压不超过 33 V。
  • 连续工作电流应低于 Ihold(1.5 A)以避免长期发热与误动作;若有间歇性峰值,可利用热余量和动作时间(500 ms)评估。
  • Imax(100 A)为短时能力,用于承受瞬态冲击,不能作为长期工作电流参考。
  • Pd(800 mW)标明器件在特定条件下的功耗能力,PCB 热阻及周围器件会影响实际温升,应在目标环境下评估温度漂移与动作特性。
  • 考虑 R1max(跳断后阻值 160 mΩ)形成的限流特性及剩余压降,确认在保护状态下系统是否能安全保持或需进一步隔离。

五、可靠性与使用建议

  • 在高温环境下器件动作电流会降低,选型时按实际最高环境温度进行降额设计。
  • 建议将器件布置在靠近被保护元件或电源输入处,减少导线和走线的串联阻抗影响动作特性。
  • 采用合适的焊接工艺(兼容 1812 尺寸的回流温度曲线),避免过热损伤元件内部结构。
  • 量产时做好样板热循环与过流测试,验证系统级行为与寿命。

六、封装与采购建议

  • 封装:1812,支持自动贴片 SMT 工艺。
  • 采购时请向供应商确认完整数据手册(包括 I-V 曲线、时间-电流特性、温度系数及可靠性测试数据),并索取样品进行实测以确保与目标系统匹配。

如需在特定工作条件(高温、长线缆、脉冲负载等)下的详细热-电仿真建议或替代型号对比,可提供具体应用参数以便进一步分析与推荐。

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