WMSIC Electronic Components

Taiwan Lu Hai MSMD200-16V MSMD200

ModelMSMD200-16V
Package1812
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MSMD200-16V
Type
Taiwan Luhai
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MSMD200-16V
Electronic Component
1
Package
1812
Electronic Component
Resettable Fuse
Electronic Component
0.095g
Electronic Component
1
Electronic Component
8s
Electronic Component
BM0265004068
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
16V
Power(Pd)
800mW
Current(Imax)
100A
Electronic Component
Electronic Component
Electronic Component
1500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MSMD200-16V 产品概述

一、产品简介

MSMD200-16V 为台湾陆海(Luhai)生产的自恢复保险丝(Polymeric PTC),封装为 1812。该器件针对低电压直流系统的过流保护设计,在过载或短路情况下自动限流并在故障消除后恢复导通,适用于各类消费电子与电源保护场合。

二、主要电气与热参数

  • 最大工作电压(Vmax):16 V
  • 最大短时冲击电流(Imax):100 A(脉冲峰值,受脉冲宽度与热量限制)
  • 保持电流(Ihold):2 A
  • 跳闸电流(Itrip):4 A(典型,跳闸时间约 8 s 指示)
  • 额定功耗(Pd):800 mW(在规定环境温度下的功耗参数)
  • 初始态阻值(Rmin):20 mΩ
  • 跳断后阻值上限(R1max):100 mΩ
  • 工作温度范围:-40 ℃ ~ +85 ℃

三、典型性能与工作原理

MSMD200-16V 采用聚合物正温度系数材料,当电流超过 Itrip 时器件内部温度上升,电阻迅速增大,从而限制电流并保护电路。故障解除后随温度下降电阻恢复到初始状态,完成自恢复功能。器件对瞬态冲击电流有一定耐受能力(Imax 达 100 A),但长期或高频重复冲击会影响寿命与恢复性能。

四、封装与机械特性

封装为业界通用的 1812(约 4.6 × 3.2 mm),便于贴片工艺与自动化生产。可匹配常规 PCB 布局与焊盘设计。具体封装尺寸与焊接工艺请参考厂方数据表。

五、典型应用场景

  • 12 V 直流供电保护(路由器、机顶盒、监控等)
  • 电池组(16 V 以下)和充电电路的过流保护(注意电池启动电流)
  • USB 及外设电源管理、电源适配器输出保护
    不建议用于高温发动机舱或必须满足汽车 AEC-Q 规范的场合(工作温度上限 85 ℃)。

六、选型与使用建议

  • 若长期工作电流接近或超过 2 A,应选择更高 Ihold 的型号或留足裕量。
  • 对于频繁脉冲或大冲击电流环境,评估 Imax 对寿命的影响并做必要的热设计。
  • PCB 设计时保证良好散热与足够焊盘面积,以利热量扩散并保证可靠动作。

七、注意事项与储存

遵循厂方回流焊和工艺规范,避免超出推荐温度和持续时间;储存于干燥、常温环境,避免潮湿和强烈机械应力。装购时请向供应商确认包装形式(卷带/盘装)与最新数据表,以便正确集成与可靠使用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.