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TDD ABS210
Configuration
1 options
Configuration
Option 171382
Available for RFQ
Technical data
Product details
13
specifications
Core information
- Product name
- TDD ABS210
- Type
- TDD
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDD
- Electronic Component
- ABS210
- Electronic Component
- 1
- Package
- ABS
- Electronic Component
- 0.168g
- Electronic Component
- 1
- Electronic Component
- BM0266040356
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TDD ABS210单相整流桥产品概述
一、产品核心定位与应用场景
TDD ABS210是一款中小功率单相整流桥，专为需要1kV耐压、2A额定连续电流的整流场景设计，属于通用型整流器件。其核心定位是兼顾「低损耗、高可靠性、宽温适应」，可替代同类规格传统产品，在成本与性能间实现平衡，覆盖工业、家电、照明等多领域电源整流需求。
二、关键电性能参数详解
ABS210的电性能参数针对实际应用优化，核心参数及意义如下：
- 正向压降（Vf）：1V@2A：额定电流2A下导通压降仅1V，导通损耗（P=I×Vf=2W）处于同类产品低位，可降低电源发热、提升效率。
- 直流反向耐压（Vr）：1kV：明确额定反向耐压1kV，满足中低压电源绝缘要求，避免电压击穿。
- 额定整流电流（If）：2A：连续工作电流2A，稳定承载常规负载，适配中小功率电源设计。
- 反向漏电流（Ir）：5μA@1kV：1kV反向电压下漏电流仅5μA（远低于行业≤10μA标准），反向损耗极小，减少器件发热。
- 非重复峰值浪涌电流（Ifsm）：55A：可承受单次10ms内55A浪涌，抵御开机、负载突变或电网波动冲击，降低损坏概率。
- 工作结温范围：-55℃~+150℃：宽温覆盖工业级高低温场景（如户外设备、低温车间），极端温度下性能稳定。
三、结构与封装特性
ABS210采用ABS标准4引脚封装，具备以下优势：
- 塑封防护：环氧树脂塑封绝缘性好、抗机械冲击，保护内部芯片免受湿度、粉尘影响。
- 引脚规范：布局符合行业通用标准，便于PCB设计与焊接，兼容现有电路布线。
- 散热适配：封装尺寸适配中小功率散热需求，配合PCB铜箔设计可满足2A连续电流散热（极端工况除外，无需额外散热片）。
四、可靠性与环境适应性
ABS210的可靠性体现在多维度：
- 低损耗长寿命：低压降+低漏电流减少热积累，避免芯片老化失效，延长使用寿命。
- 抗浪涌能力强：55A浪涌电流应对电源瞬态冲击，降低维护成本。
- 宽温稳定：-55℃~+150℃结温范围，无需额外温度补偿，适应各类环境。
- 品牌质量保障：台冠电子（TDD）生产，产品经高低温循环、浪涌、耐压等严格测试，质量稳定。
五、典型应用领域
ABS210的通用设计使其可广泛应用于：
- 开关电源：辅助/主电源前端整流，实现AC-DC转换。
- 家电控制板：洗衣机、空调、冰箱电源模块，满足家电整流需求。
- 工业自动化：PLC、传感器、小型控制器电源，适应工业现场环境。
- 照明驱动：LED路灯、室内照明驱动电源前端整流，兼顾效率与成本。
- 小型逆变器：光伏微型逆变器、车载逆变器前端AC-DC环节。
综上，TDD ABS210是一款性价比突出的通用整流桥，适合中小功率电源系统的整流需求，可稳定应用于多行业场景。
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