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TDD US2G
Configuration
1 options
Configuration
Option 171386
Available for RFQ
Technical data
Product details
13
specifications
Core information
- Product name
- TDD US2G
- Type
- TDD
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDD
- Electronic Component
- US2G
- Electronic Component
- 1
- Package
- SMB
- Electronic Component
- 0.184g
- Electronic Component
- 1
- Electronic Component
- BM0266040352
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
US2G快恢复二极管产品概述
一、产品核心定位与应用场景
US2G是台冠电子（TDD）推出的快恢复/高效率整流二极管，采用SMA（DO-214AC）贴片封装，属于独立式中功率器件。其核心优势在于快速反向恢复特性与稳定的电性能，主要面向需要高频开关、低损耗整流的场景，涵盖消费电子、工业控制、电源设备等领域，是替代普通整流管的高性价比选择。
二、关键电性能参数详解
US2G的参数设计兼顾持续工作能力与瞬态耐受能力，核心参数如下：
- 正向压降（Vf）：典型值1.65V@2A（直流电流），低导通损耗可提升电源效率；低电流场景下（如1A）可低至1.3V，适配小功率应用。
- 直流反向耐压（Vr）：400V，覆盖220V交流整流后的310V峰值电压，满足中低压整流需求。
- 持续整流电流（If）：2A（直流），稳定承载中功率负载的持续电流，避免过载损坏。
- 反向恢复时间（Trr）：75ns，远快于普通整流管（μs级），显著降低高频开关损耗，提升100kHz以上电源的转换效率。
- 工作结温范围：-55℃~+150℃，宽温设计适配工业级环境（低温户外、高温车间），极端温度下性能稳定。
- 非重复峰值浪涌电流（Ifsm）：50A（8.3ms脉冲），可承受电路启动、负载突变时的瞬态大电流，提升电路可靠性。
三、封装与可靠性设计
US2G采用SMA贴片封装（DO-214AC），具备以下特点：
- 体积小巧：尺寸约2.7mm×1.7mm×1.0mm，适配高密度PCB布局，满足小型化电源、便携设备需求。
- 散热优化：独立式封装结构便于热量传导，结合150℃最高结温，有效避免热积累导致的性能下降。
- 可靠性保障：台冠电子采用工业级工艺，封装密封性好（防潮、防尘），参数一致性高，批量供货稳定，降低量产风险。
四、适用典型电路场景
US2G的性能匹配多种高频/中功率整流场景，典型应用包括：
- 开关电源次级整流：替代普通整流管可减少反向恢复损耗，提升PC电源、LED驱动电源效率5%~10%。
- 逆变器/UPS输出整流：逆变电路输出的高频交流电需快速整流，75ns的Trr避免波形失真，适配UPS、太阳能逆变器。
- 工业控制电源：宽温范围适配PLC、伺服驱动器等设备，满足工业环境的温度波动需求。
- 小型家电控制电路：电磁炉、微波炉的电源整流，50A浪涌能力承受启动脉冲，提升家电可靠性。
- LED模组驱动：中功率LED模组（户外显示屏、路灯）的整流环节，2A持续电流覆盖多串LED供电。
五、品牌与品质保障
US2G由台冠电子（TDD）生产，该品牌专注功率半导体研发，产品符合RoHS环保标准，通过CE、ISO9001认证。器件参数一致性、可靠性经严格测试，批量供货周期短，适合中小批量及大规模量产需求。
US2G以高性价比、稳定性能成为中功率快恢复整流的优选器件，可满足多数民用及工业场景的整流需求。
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