Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UNI-ROYAL 0201WMJ0103TEE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0201WMJ0103TEE
- Type
- UNI-ROYAL
- Minimum package
- 15000 圆盘
Technical parameters
- Power
- 50mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0201WMJ0103TEE
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.008g
- Electronic Component
- 10kΩ
- Electronic Component
- 10
- Electronic Component
- BM0257242288
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 25V
- Electronic Component
- ±200ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201WMJ0103TEE 产品概述
一、产品简介
0201WMJ0103TEE 是 UNI-ROYAL（厚声）系列的一款高密度贴片厚膜电阻，阻值 10kΩ，精度 ±5%，封装规格为 0201（公制 0603 小型化对应）。该器件面向移动终端、可穿戴设备、物联网模块及超高密度 PCB 设计，兼顾体积最小化和基本电性能要求。
二、主要技术参数
- 电阻类型：厚膜电阻
- 阻值：10kΩ
- 精度：±5%（F）
- 功率额定值：50mW（0.05W）
- 最大工作电压：25V（以厂家标称为准）
- 温度系数（TCR）：±200 ppm/℃
- 工作温度范围：-55℃ ~ +155℃
- 封装：0201（超小型贴片）
- 品牌：UNI-ROYAL（厚声）
三、性能特点
- 小体积：0201 封装可显著降低 PCB 占位面积，利于高密度布板与轻薄化设计；
- 稳定度适中：±5% 精度配合 ±200 ppm/℃ 的 TCR，适用于对精度要求不高但需体积受限的信号/偏置网络；
- 宽温工作：-55℃~+155℃ 的工作温度范围，适应工业级及多数消费电子环境；
- 常规回流兼容：适用于标准 SMT 贴装与常规回流焊工艺（建议遵循厂家回流曲线及工艺规范）。
四、典型应用场景
- 移动设备、可穿戴产品中的分压、偏置与限流电路；
- 物联网节点、蓝牙模块、传感前端的阻值网络；
- 高密度 PCB 的信号终端、拉/下拉电阻以及一般用途的替代电阻应用；
- 对热噪声与精度要求不极端的工业电子产品。
五、设计与使用建议
- 功率与电压限制：额定功率 50mW，按 P=V^2/R 计算，阻值 10kΩ 时对应的电压极限约为 22.36V；因此在实际应用中应取额定电压与由功率限制计算出的较低值作为安全上限，以避免过载。
- 热管理：0201 封装散热能力有限，长时间在额定功率下工作或靠近热源时应进行功率降额或留有安全裕度。
- 贴装与回流：推荐使用符合 0201 工艺的贴片机与回流参数，避免过高回流峰值温度及重复加热；焊膏量与焊盘设计请参照厂商推荐的 land pattern。
- 可靠性与清洁：避免强酸强碱清洗剂浸泡，推荐使用中性或常规电子清洗工艺；搬运与贴装时注意防静电。
六、包装与可靠性
产品通常以卷带（Tape & Reel）方式供货，适配自动贴装机。UNI-ROYAL 提供相关可靠性试验数据（温度循环、湿热、机械冲击等），可根据项目需求向供应商索取详细的可靠性报告与回流曲线，以便在量产前完成可靠性验证与设计确认。
如需样品、详细封装图或参考 PCB land pattern，请联系供应商或代理获取 0201WMJ0103TEE 的完整技术资料与应用说明。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
