Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UMW ULN2003A
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UMW ULN2003A
- Type
- UMW
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- UMW
- Electronic Component
- ULN2003A
- Electronic Component
- 1
- Package
- SOP-16
- Type
- BJT
- Electronic Component
- Darlington Transistor Array
- Electronic Component
- 0.292g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Electronic Component
- BM69416981
- Operating Temperature
- 40℃~+85℃
- Current(Ir)
- 10uA
- (Vf)
- 1.7V
- Capacitor(Ci)
- 15pF
- Current(on)
- 0.93mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ULN2003A 产品概述
一、概述
ULN2003A是一款高性能的达林顿晶体管阵列，广泛应用于驱动电机、继电器、灯光和其他负载的电路。该元器件由UMW（友台半导体）生产，能够在-40℃到+85℃的宽温度范围内稳定工作，且最大工作电压可达50V，最大负载电流达到30V。这使得ULN2003A非常适合于工业自动化、汽车电子、家电控制等多种应用场景。
二、达林顿晶体管阵列的特点
达林顿配置：ULN2003A使用了达林顿晶体管配置，这种配置能提供高增益。相较于单个晶体管，达林顿对电流的放大能力显著提高，可以用较小的输入信号控制较大的负载。
多通道设计：该晶体管阵列提供七路独立的开关控制，每个通道可以独立驱动不同的负载，增加了电路设计的灵活性和扩展性。其多路输出设计特别适合需要多个独立控制的场合，比如多通道电机驱动等。
宽电压工作范围：ULN2003A能够在50V的高电压下稳定工作，适合于多种高压应用。无论是工业控制还是家电应用，均能提供可靠的性能。
高耐热性：ULN2003A的工作温度范围从-40℃到+85℃，在高温和低温环境下均可保持良好的性能，适合多变的工作环境，确保电子设备的稳定性和可靠性。
简化的电路设计：其内部集成的二极管可防止反向电流对电路造成破坏，这让设计者不再需要额外加装保护二极管，极大简化了电路设计。
三、技术参数
- 封装：SOP-16
- 工作温度范围：-40℃ ~ +85℃
- 最大工作电压：50V
- 最大负载电流：30V
ULN2003A的封装形式采用SOP-16，这种小型化设计不仅节省了 PCB 空间，也方便大量集中布置，适合高密度电路设计。
四、应用领域
ULN2003A广泛应用于以下几个领域：
电机驱动：可用于步进电机、直流电机等的驱动，通过其多通道输出，控制多相电机的运动。
继电器控制：提供高电流控制能力，非常适合驱动继电器和接触器，广泛应用于家电、家居及工业自动化控制中。
LED驱动：能够高效驱动多个高功率LED，通过其高电流能力，解决大功率LED需要的电流控制问题。
信号放大：在需要将微弱信号放大的场合，也可以利用其高增益特性进行应用。
自动化设备：在各种自动化设备中，ULN2003A可以作为开关和信号放大器，尤其是在机器人控制和生产线自动化等高要求的应用中，发挥其极佳的性能。
五、总结
总体而言，ULN2003A达林顿晶体管阵列是一个性能优越、功能强大的电子元器件，其多路控制能力、高耐热性以及宽广的电压工作范围，使其成为各种电子应用中理想的选择。无论是在工业自动化还是消费类电子产品中，ULN2003A都能提供稳定、可靠的解决方案，满足不断增长的市场需求。对于设计人员而言，它的使用简化了电路设计，提高了系统的整体性能，值得广泛应用与推广。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
