WMSIC Electronic Components

UMW PESD15VL1BA

ModelPESD15VL1BA
PackageSOD-323
BrandUMW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UMW PESD15VL1BA
Type
UMW
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
UMW
Electronic Component
PESD15VL1BA
Electronic Component
1
Package
SOD-323
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.032g
Electronic Component
1
Cj- Capacitor
20pF
Electronic Component
BM0225985335
Voltage
32V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
500nA
Voltage(VBR)
16.7V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PESD15VL1BA 产品概述

一、产品简介

PESD15VL1BA 是友台半导体(UMW)推出的一款小尺寸双向瞬态电压抑制器(TVS/ESD),封装为 SOD‑323。该器件专为静电放电(ESD)和雷电浪涌(Surge)防护设计,满足 IEC 61000‑4‑2、IEC 61000‑4‑4 与 IEC 61000‑4‑5 等抗扰度标准,适用于各类接口与电路板的前端保护。

二、主要特点

  • 钳位电压 Vc(典型):32 V,提供有效的过电压限制能力。
  • 击穿电压 VBR:16.7 V(典型)。
  • 反向截止电压 Vrwm:15 V,适合 12–15V 级别工作环境的瞬态抑制。
  • 峰值脉冲功率 Ppp:320 W(8/20 μs 波形),能承受较强浪涌能量。
  • 峰值脉冲电流 Ipp:10 A(8/20 μs)。
  • 结电容 Cj:20 pF,适度低电容设计,兼顾速率与保护性能。
  • 反向漏电流 Ir:≤ 500 nA,静态漏电小,对电路影响低。
  • 极性:双向,适合对称信号线或没有明确极性的接口保护(例如某些通信线、音频、串口等)。
  • 尺寸小巧,SOD‑323 封装,便于空间受限应用。

三、电气性能要点

  • 工作耐压(Vrwm):15 V(反向截止电压),在此电压下器件保持高阻态。
  • 击穿特性:典型击穿电压 16.7 V,超过 Vrwm 后进入导通以限制电压上升。
  • 钳位性能:在 8/20 μs 浪涌下,钳位电压约 32 V(典型),可将瞬态电压钳位在安全范围内,保护后端器件。
  • 能量吸收能力:320 W(8/20 μs)峰值功率与 10 A 峰值脉冲电流,适用于中等强度的瞬态冲击。
  • 低结电容(20 pF)在多数低速及中高速信号应用中影响有限,但对超高速接口仍需评估。

四、典型应用场景

  • 面向 I/O 接口的前端保护:串口、RS‑232/RS‑485、GPIO 等。
  • 通信与控制板的接插件、连接器防护。
  • 工业控制、楼宇自控设备、防护对电源与信号线的浪涌与静电放电。
  • 便携设备与消费电子的接口保护(在电容允许范围内)。
  • 任何要求双向保护且空间受限的场合。

五、封装与安装建议

  • 封装:SOD‑323,尺寸小,适合高密度 PCB 布局。
  • 布局建议:将 PESD15VL1BA 尽量靠近被保护的外部接口或连接器放置,走线短且粗,避免长串联走线;地线应尽可能短且通过足够的回流路径(多个过孔)接地。
  • 焊接:兼容常规回流焊工艺,注意热循环与焊膏量对小封装的影响。
  • 热管理:器件为瞬态能量吸收器件,不适合长期稳态大电流工作;如果周围存在频繁高能浪涌,应评估器件温升与寿命,并考虑并联或使用额外熔断保护。

六、选型与注意事项

  • 本器件为双向 TVS,适用于无极性或需双向保护的信号线;若为单向电源轨保护,应优先选择单向型 TVS。
  • 结电容 20 pF 对超高速差分接口(如 USB3.0、PCIe、HDMI 等)可能影响信号完整性,选型时请结合具体速率与眼图要求评估。
  • 漏电流 500 nA 在多数数字与模拟场合可接受,但对超低功耗电路需注意静态功耗影响。
  • 订购时确认封装与包装代码,便于贴片生产与库存管理。

如需完整的数据手册、封装图、典型特性曲线或 PCB 参考封装文件(CAD/GERBER),可进一步提供以便匹配生产与设计要求。

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