Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UMW ESD5451N
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UMW ESD5451N
- Type
- UMW
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- UMW
- Electronic Component
- ESD5451N
- Electronic Component
- 1
- Package
- DFN1006-2
- Electronic Component
- Electronic Component
- Type
- ESD
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.011g
- Electronic Component
- 1
- Cj- Capacitor
- 17.5pF
- Electronic Component
- BM0066736989
- Voltage
- 9V
- Electronic Component
- IEC 61000-4-4；IEC 61000-4-5；IEC 61000-4-2
- Current(Ir)
- 1nA
- Voltage(VBR)
- 5.1V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：ESD5451N（UMW友台半导体）
一、基本信息
ESD5451N 是由友台半导体（UMW）推出的一款专用静电放电（ESD）保护器件，采用 DFN1006-2 封装。该器件主要用于保护敏感电子元器件免受静电放电和电压瞬变的损害，广泛应用于移动通信、消费电子、工业电子等领域。
二、产品特性
静电放电保护：ESD5451N 提供强大的静电放电保护能力，符合 IEC 61000-4-2 标准的级别4（±15kV 接触放电，±30kV 空气放电），能够有效防止静电对设备的损坏。
低导通电压：该器件具有低的击穿电压和导通电压，确保在正常工作状态下对信号的干扰最小，提升设备的可靠性和性能。
快速响应时间：ESD5451N 具备较快的响应时间，能够迅速对瞬态过压事件作出反应，从而及时保护所连接的敏感设备。
小尺寸封装：DFN1006-2 封装提供了紧凑的尺寸，有助于节省PCB空间，满足现代电子产品对小型化的需求。
热稳定性：该器件采用高性能材料，具有良好的热稳定性，能够在较宽的温度范围内稳定工作，保证长期的可靠性。
三、应用领域
ESD5451N 可广泛应用于多个领域，包括但不限于：
移动通信设备：如智能手机、平板电脑及其他移动终端，保护其内部电路免受静电放电造成的故障。
消费电子产品：如数字相机、电视和音响设备，确保其在使用过程中的安全。
工业电子：适用于各类工业应用设备，抵御环境中可能发生的静电干扰。
汽车电子：在汽车电子控制单元和传感器中使用，以确保其在恶劣环境下的正常运行。
PC和外设：如主板、USB接口及其他外设，为计算设备提供保护，减少故障率。
四、设计考虑
在使用 ESD5451N 进行电路设计时，工程师需要考虑以下几点：
布局和布线：确保器件尽可能靠近受保护的端口和信号线，以降低引线电感，提升保护效果。
额定工作电压：确保工作电压和信号频率在器件的安全工作范围内，以获得最佳的性能。
热管理：在高功率密度的应用中，需要适当的散热设计以避免器件过热，确保其长期稳定运行。
五、总结
ESD5451N 是一款高性能、紧凑型静电放电保护器件，能够为各种电子产品提供有效的ESD保护。其出色的性能和广泛的应用场景，使得它成为设计现代电子设备时的优选元件。通过合理的电路设计和布局应用，ESD5451N 将大大提升设备的可靠性和使用寿命，在现代电子行业中具有重要的技术和经济价值。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
