WMSIC Electronic Components

UMW LMV321IDBVR

ModelLMV321IDBVR
PackageSOT-23-5
BrandUMW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UMW LMV321IDBVR
Type
UMW
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
UMW
Electronic Component
LMV321IDBVR
Electronic Component
1
Package
SOT-23-5
Electronic Component
Operational Amplifier
Electronic Component
0.039g
Electronic Component
1
Electronic Component
Output
Electronic Component
BM0226578577
Operating Temperature
40℃~+125℃
Amplifier
1
Output Current
25mA
(SR)
520V/ms
Power Supply Voltage
2.1V~5.5V
Static Current(Iq)
45uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LMV321IDBVR 产品概述

一、概述

LMV321IDBVR 是 UMW(友台半导体)推出的一款单路电压反馈运算放大器,支持轨到轨输入与轨到轨输出,适用于低功耗、便携与精密模拟前端设计。本器件在宽温度范围(-40℃ ~ +125℃)和小封装(SOT-23-5)下,兼具低噪声、低偏置电流与较强驱动能力,为传感器接口、ADC 缓冲、滤波与便携式信号处理提供理想选择。

二、主要电气特性

  • 共模抑制比(CMRR):70 dB
  • 噪声密度(eN):20 nV/√Hz @ 10 kHz
  • 轨到轨输入/输出(Rail-to-Rail I/O)
  • 最大电源差(Vdd-Vss):7.5 V;典型单电源工作范围:2.1 V ~ 5.5 V
  • 输入失调电压(Vos):5 mV;温漂(Vos TC):2.7 µV/℃
  • 输入偏置电流(Ib):10 pA;输入失调电流(Ios):10 pA
  • 增益带宽积(GBP):1 MHz;压摆率(SR):520 V/ms
  • 静态电流(Iq):45 µA;输出电流最高约 25 mA
  • 工作温度:-40℃ ~ +125℃;封装:SOT-23-5(单路)

三、性能亮点与设计要点

  • 低静态电流与宽工作电压:45 µA 的静态电流适合电池供电系统;2.1 V 起的单电源工作使其可用于低压系统。注意最大电源差不能超过 7.5 V。
  • 轨到轨 I/O:对输入/输出摆幅要求高的系统(如低电压传感器接口、单供应模数转换前端)可获得较大的动态范围。
  • 低噪声与低偏置:20 nV/√Hz 的噪声密度与 10 pA 的偏置电流,利于高阻抗传感器(温度、光电、压力)与精密测量应用。
  • 适中带宽与高速瞬态响应:1 MHz 的 GBP 适合低至中等增益应用;520 V/µs 的高压摆率对阶跃输入响应良好,但需注意在驱动容性负载时可能需要补偿以保持稳定。

四、典型应用场景

  • 电池供电便携设备的放大与缓冲(传感器前端、ADC 驱动)
  • 精密模拟前端(温度/光电/压阻传感器)
  • 主动滤波器、积分器与一般运算放大器用途
  • 需要小封装、高温稳定性的工业与消费类电子产品

五、PCB 布局建议与可靠性注意事项

  • 电源去耦:靠近 Vdd/Vss 引脚放置 0.1 µF 陶瓷电容,减小寄生阻抗与开关噪声。
  • 输入端布线要短且屏蔽,避免噪声耦合,尤其在高阻抗传感器接口处。
  • 驱动长电缆或容性负载时建议在输出端串联小电阻(10–100 Ω)以防振荡。
  • 封装热管理:SOT-23-5 热阻较高,长时间大电流输出或高温环境下应注意功耗与接触散热。

六、结语

LMV321IDBVR 在低功耗、低噪声与轨到轨性能之间取得良好平衡,适合对封装尺寸与功耗有严格要求的便携与工业应用。在实际设计中,应根据系统增益与负载特性验证稳定性并做好电源与接地布局,以发挥器件最佳性能。

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