Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UMW TLP185GB-S TLP185GB
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UMW TLP185GB-S
- Type
- UMW
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- UMW
- Electronic Component
- TLP185GB-S
- Electronic Component
- 1
- Package
- SOP-4-2.54mm
- Electronic Component
- Transistor Output Optocoupler
- Electronic Component
- 0g
- Electronic Component
- 1
- Electronic Component
- 3us
- Electronic Component
- BM0216017329
- Operating Temperature
- 55℃~+110℃
- Load Voltage
- 80V
- Type
- DC
- Output Current
- 50mA
- Output Type
- Photoelectric Transistor
- Output Channel Count
- 1
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TLP185GB-S 是一款由友台半导体（UMW）生产的高性能光耦（光电耦合器），通常用于在电路之间进行信号的电绝缘传输。此款光耦采用了SOP-4-2.54mm封装，具有体积小、稳定性高、易于集成等优点，尤其适用于各类电子设备的信号隔离及接口转换。以下是 TLP185GB-S 产品的详细概述。
产品特点
高隔离性能: TLP185GB-S 具备良好的电气隔离性能，输入与输出之间的隔离电压高达 several kilovolts。这使得它能有效防止高电压环境对低电压电路的干扰，确保电路的安全运行。
优越的光电性能: 该光耦内部集成了高灵敏度的光电三极管和红外发光二极管（LED）。在输入端施加信号后，LED发光并激发输出端的光电三极管，从而实现信号从输入到输出的精确传递。
低导通电压和高输出电流: TLP185GB-S 的导通电压在 1.25V 左右，且具有高达 50mA 的输出电流能力。这使得它能够驱动种类丰富的负载，适应多种应用需求。
广泛的工作温度范围: 该光耦设计可以在 -40°C 到 +85°C 的温度范围内稳定工作，适合于恶劣环境下的应用。
小型封装: 使用 SOP-4-2.54mm 封装，使得 TLP185GB-S 特别适合于空间受限的电子设备，如消费电子、工业控制、汽车电子等领域。
应用场景
工业自动化: 在工业控制系统中，TLP185GB-S 可以用来实现传感器与控制单元之间的隔离，确保传输信号的可靠性，避免干扰。
通讯设备: 在数据通讯接口中，光耦能够有效抑制噪声对信号的影响，保证信号的清晰传输。
电源管理系统: 它适用于电源监测中，能够安全有效地传递功率信息，确保安全的电力管理。
家电控制: 在智能家居设备中，可用于遥控信号的传输，同时保持电气安全。
选择理由
选择 TLP185GB-S 的理由不仅在于其卓越的性能，还在于强大的可靠性与灵活的应用能力。这款光耦在市场上的常见应用，以及出色的性价比，都让其成为电子工程师设计电路时的理想选择。
结论
总体而言，TLP185GB-S 是一款集多重优势于一身的高性能光耦，其在信号隔离方面的优势让它成为许多电子产品的基础器件。无论是在快速发展的现代工业领域，还是在日常消费电子产品中，TLP185GB-S 都展现出了其不可替代的价值。选择该光耦，将有助于提升产品的整体性能与安全性，满足日益增长的市场需求。
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