WMSIC Electronic Components

UMW PESD5V0S1BB

ModelPESD5V0S1BB
PackageSOD-523
BrandUMW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UMW PESD5V0S1BB
Type
UMW
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
UMW
Electronic Component
PESD5V0S1BB
Electronic Component
1
Package
SOD-523
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.001g
Electronic Component
1
Cj- Capacitor
35pF
Electronic Component
BM0218953145
Voltage
14V
Electronic Component
IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
5nA
Voltage(VBR)
9.5V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

UMW PESD5V0S1BB 产品概述

一、产品简介

PESD5V0S1BB 是友台半导体(UMW)推出的一款用于电路保护的半导体器件,采用SOD-523封装。这款产品专为快速瞬态电压抑制(TVS)而设计,能够有效保护敏感电子元件免受静电放电(ESD)、电压浪涌和其他瞬时电压尖峰的影响。凭借其优异的性能和紧凑的封装,PESD5V0S1BB 在广泛的消费电子、工业控制、通讯设备等应用中得到了广泛的应用。

二、主要特性

  1. 尖峰电压抑制能力:PESD5V0S1BB 的反向击穿电压为5V,能够有效抑制高达数千伏特的瞬态电压,确保电路的稳定性和可靠性。

  2. 快速响应时间:该器件能够在纳秒级时间内响应突发电压,迅速将过压电平钳位到安全范围内,从而保护下游电路。

  3. 低电容设计:具有极低的输入电容(通常在几皮法至十几皮法范围内),使其非常适合高频应用,不会对信号传输造成显著影响。

  4. 小型封装:其SOD-523的封装方式使其具备高度小型化的优势,便于在空间受限的电路板中使用,并且也有助于提高系统的整体集成度。

  5. 高可靠性:PESD5V0S1BB 具备良好的热稳定性和长期可靠性,适合在各类恶劣环境下工作。

三、应用领域

  1. 消费电子:广泛应用于手机、平板电脑、笔记本电脑及其他移动设备中,保护数据传输接口,如USB、HDMI、SD卡等,确保设备在遭受ESD侵害时的稳定性和可靠性。

  2. 工业控制:在工业自动化、PLC、传感器及执行器驱动电路中,PESD5V0S1BB 可有效避免由于电压浪涌和ESD造成的通信错误和设备损坏。

  3. 通讯设备:在基站、路由器、交换机等通讯设备中,使用此元件可以保护信号线和电源线,减少网络中断及数据损失的风险。

  4. 汽车电子:随着汽车电子设备的普及,PESD5V0S1BB 也被应用于汽车通信和信息娱乐系统的保护,确保在外部电磁干扰和瞬态电压情况下的稳定运行。

四、结论

UMW PESD5V0S1BB 是一款专业设计用于瞬态电压抑制的保护器件,凭借其优秀的保护性能、快速响应和小型封装,成为保护电子设备的重要选择。无论是消费电子、工业控制还是汽车电子领域,其均能提供高效的ESD及电压突波防护。随着电子设备向更高集成度和miniaturization的发展, PESD5V0S1BB 作为电路保护的理想解决方案,具有广泛的市场前景和应用潜力。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.