WMSIC Electronic Components

UMW APM4953

ModelAPM4953
PackageSOP-8
BrandUMW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UMW APM4953
Type
UMW
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
UMW
Electronic Component
APM4953
Electronic Component
1
Package
SOP-8
Electronic Component
2 P
Electronic Component
MOSFET
Electronic Component
0g
Electronic Component
1
Electronic Component
BM0227327802
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
2W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
30V
Capacitor(Ciss)
504pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

APM4953 产品概述

一、产品简介

APM4953 是友台半导体(UMW)推出的双通道 P 沟道场效应管,采用 SOP-8 封装,面向高效电源管理与开关应用设计。器件在 30V 的漏源电压等级下提供良好的导通性能和中等功率耗散能力,适用于便携式设备、电源开关与汽车电子等场景的高边开关与反向保护场合。

二、主要参数一览

  • 通道数:2 个 P 沟道 MOSFET(双通道集成)
  • 漏源电压(Vdss):30 V
  • 连续漏极电流(Id):5.3 A
  • 导通电阻(RDS(on)):38 mΩ @ 10 V
  • 阈值电压(Vgs(th)):1.5 V @ 250 μA
  • 总栅极电荷(Qg):12 nC
  • 输入电容(Ciss):504 pF
  • 反向传输电容(Crss):56 pF
  • 输出电容(Coss):68 pF
  • 功耗耗散(Pd):2 W
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:SOP-8

三、特性与优势

  • 低导通电阻:38 mΩ 的 RDS(on) 在开态下降低导通损耗,适合要求效率的直流供电路径。
  • 中等驱动需求:12 nC 的总栅极电荷使器件在常见驱动器与 MCU 直接驱动下切换速度适中,兼顾开关损耗与 EMI 特性。
  • 体积与集成度:SOP-8 双通道封装在节省 PCB 面积的同时便于实现对称或独立负载控制。
  • 宽温度范围:-55 ℃ 至 +150 ℃ 的工作温度范围适应工业级与严格环境应用。

四、典型应用

  • 电源管理:高侧负载开关、背靠背电源断路、负载断开控制。
  • 电池系统:电池保护、反向充电防护与切换。
  • DC-DC 转换器:低侧/高侧开关(视具体拓扑与驱动方式),用于对效率有一定要求的应用。
  • 汽车电子与工业设备:30V 级别电源的控制与保护场合。

五、设计与使用建议

  • 栅极驱动:作为 P 沟道器件,栅源电压相对于源极为关键;在设计时应保证驱动逻辑能提供合适的栅源电压摆幅以完全导通或关断器件。注意按厂商规范限制 VGS 峰值,避免超出器件极限。
  • 热管理:器件 Pd 为 2 W,SOP-8 塑封封装对热阻较为敏感。在大电流或高占空比工作时应通过增加 PCB 铜箔面积、加装散热铜垫与通孔来降低结温,必要时评估热失配与降额。
  • 布局建议:尽量缩短电流回路(漏极/源极)走线,增大散热铜面,靠近电源入/出端放置旁路电容以减少寄生电感。Crss 值提示对开关瞬态有一定敏感性,设计时关注栅阻与驱动阻抗以控制开关振铃与 EMI。
  • 开关损耗与驱动能力平衡:Qg=12 nC 表明在高频切换时需要合理驱动电流以降低开关时间和相关损耗,同时可通过小型串联栅阻或 RC 缓冲控制 dv/dt。

六、封装与可靠性

SOP-8 封装便于自动化贴装与批量生产,但热散能力较金属封装有限。器件在 -55 ℃ 到 +150 ℃ 的额定工作范围适合工业级应用,实际使用应参考产品的完整数据手册来校核特定工况下的电热与可靠性参数。

七、注意事项

  • 使用前请参阅完整规格书获取 VGS 最大额定值、峰值电流能力及 SOA 限制;本文基于给定关键参数做概述,不替代规格书中的限制与建议。
  • 在并联或多通道并用时注意匹配 RDS(on) 与热均衡问题,必要时采用电流均衡措施。
  • 在高频或高 dv/dt 场合设计时,需评估 Crss 带来的 Miller 效应并相应调整栅极驱动策略。

总结:APM4953 以 30V 等级、双通道 P 沟道与较低的导通电阻为核心,适合需要紧凑封装和可靠高边/反向开关功能的电源管理应用。合理的驱动、良好的 PCB 热设计和遵循规格书限制,将有助于发挥其最佳性能。

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