Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UMW CDSOD323-T05C(UMW) CDSOD323
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UMW CDSOD323-T05C(UMW)
- Type
- UMW
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- UMW
- Electronic Component
- CDSOD323-T05C(UMW)
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.032g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Cj- Capacitor
- 0.8pF
- Electronic Component
- BM0263439581
- Operating Temperature
- 40℃~+125℃
- Voltage
- 20V
- Electronic Component
- IEC 61000-4-2
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CDSOD323-T05C (UMW) 产品概述
一、产品简介
CDSOD323-T05C 是友台半导体（UMW）推出的一款双向瞬态抑制二极管（TVS），采用小型 SOD-323 封装，专为对敏感电子节点进行交流/双向瞬态过压保护而设计。器件在静态电压 5V 工作下具备低漏电与快速响应特性，适合保护小体积、高速信号或电源线上因静电放电和浪涌导致的瞬态冲击。
二、主要规格参数
- 极性：双向
- 反向截止电压 (Vrwm)：5V
- 击穿电压：6.5V
- 钳位电压：20V
- 峰值脉冲电流 (Ipp)：15A @ 8/20μs
- 峰值脉冲功率 (Ppp)：300W @ 8/20μs
- 反向电流 (Ir)：1μA
- 结电容 (Cj)：0.8pF
- 通道数：单路
- 工作温度：-40℃ ~ +125℃
- 防护等级：符合 IEC 61000-4-2（静电放电）标准
- 封装：SOD-323
- 品牌：UMW（友台半导体）
三、主要特点
- 小封装：SOD-323 体积小，便于在空间受限的电路板上布局。
- 低电容：0.8pF 的结电容对高速数据线影响小，适合 USB、HDMI、串行接口等高速信号保护。
- 双向保护：能在正负极性瞬态中提供对称钳位，适用于交流或差分信号路径。
- 高能量吸收能力：300W/8/20μs 的峰值功率和 15A 的脉冲电流能力，可应对常见浪涌与 ESD 冲击。
- 低漏电：1μA 的反向漏电有利于低功耗、待机敏感系统。
四、典型应用场景
- 移动设备与便携终端的接口保护（如 USB、耳机、数据线）。
- 通信设备、网络模块的差分信号保护。
- 汽车、工业控制中对小型传感器或控制线的瞬态抑制（环境温度 -40℃~+125℃）。
- 以太网、串口、LCD 驱动等对低电容保护器件有要求的应用。
五、设计与使用注意事项
- 建议将 TVS 器件尽可能靠近可能遭受冲击的连接器或信号源放置，以减小环路电感和走线长度。
- 在高能量冲击场合，应参考 PCB 散热与焊盘尺寸，以保证器件的热耗散能力。
- 虽然器件可承受 8/20μs 波形的高峰功率，但不适合作为连续功率耗散元件，避免持续过压。
- 对高速差分信号，注意器件并联对阻抗的影响，0.8pF 虽低但仍需在高精度系统中评估。
- 在汽车或严苛工业应用中，配合系统级浪涌抑制设计（如保险丝、串联电阻）以提高可靠性。
六、封装与可靠性
SOD-323 小型封装适合自动贴装生产，有利于降低占板面积。器件工作温度范围宽，满足一般消费电子与部分工业/车辆环境的可靠性需求。符合 IEC 61000-4-2 防护能力，适用于需要静电防护的应用场景。
七、总结
CDSOD323-T05C (UMW) 以其双向保护、低结电容、较高峰值吸能能力及小型化封装，适合对高速信号和有限空间电路的瞬态保护需求。在实际设计中应合理布局与热管理，以发挥器件的最佳保护效果。若需扩展电气特性曲线或典型波形建议，建议参考厂方完整数据手册或联系 UMW 技术支持获取详细曲线与可靠性数据。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
