Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UMW 30N06
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UMW 30N06
- Type
- UMW
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- UMW
- Electronic Component
- 30N06
- Electronic Component
- 1
- Package
- TO-252
- Electronic Component
- 1 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 0.46g
- Electronic Component
- 1
- Electronic Component
- BM0084329879
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 55W
- Electronic Component
- Electronic Component
- Electronic Component
- 2500
- Voltage(Vdss)
- 60V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
30N06 产品概述
一、产品简介
30N06是一款高性能的N沟道MOSFET(场效应管)，由友台半导体(UMW)生产，封装形式为TO-252(DPAK)。该器件适用于多种中高频率开关电源和功率控制应用，能有效驱动高达30A的电流，同时承受高达60V的电压。由于其优越的电子特性和可靠性，30N06被广泛应用于电源管理、电机驱动、LED驱动、和其他需要高效能开关的电路中。
二、主要参数
- 类型：N沟道MOSFET
- 功率：最大功率承受约为55W
- 电压：工作电压可达60V
- 电流：持续工作电流可达30A
- 封装形式：TO-252(DPAK)
- 环境温度范围：-55°C至+150°C
三、应用领域
30N06 MOSFET的应用领域十分广泛，主要集中在以下几个方面：
开关电源：广泛应用于DC-DC转换器、AC-DC电源等设备中。它的高开关频率和低导通损耗使得其能有效提高电源的工作效率。
电机驱动：在一些需要快速开关和高效控制的电机驱动电路中，30N06能够稳定地处理高电流和高电压，确保电机的平稳运行。
LED驱动：在LED驱动电路中，30N06可用作开关器件，控制LED的开关，从而调节亮度并提高能源利用效率。
电子负载：可用于电子负载测试设备，能够为负载提供稳定的电流输出，帮助开发和验证其他电子器件。
逆变器：在逆变器中，30N06可用于控制输出功率的开关，大幅提高逆变效率。
四、技术优势
低导通电阻(Rds(on))：30N06MOSFET具备低导通电阻的特性，这意味着在通电状态下示出的损耗极小，从而提高了电路的整体效率，减少了发热。
高开关速度：其较高的开关速度使得该MOSFET适用于高频率的开关应用，有助于改善电源转换效率和响应时间。
热管理能力：TO-252封装设计使得30N06该器件具有优良的散热性能，能够在高功率应用中良好表现，并确保长期稳定工作。
可靠性和稳定性：凭借其坚固的封装和出色的热管理，30N06在各种外部环境下均能可靠地工作，有效降低故障率。
五、选择理由
选择30N06 MOSFET的理由包括：
- 优质品牌：UMW作为电子元器件行业中的知名厂家，其产品质量得到了广泛认可和信赖。
- 性价比高：与同类产品相比，30N06在性能和价格之间提供了良好的平衡，是设计中的经济有效的选择。
- 易于使用：该器件的封装形式使得其在PCB布局和焊接过程中简便，广泛适应不同电路设计需求。
六、总结
30N06是一款具有高级性能的N沟道MOSFET，凭借其多样的应用领域和优越的电子特性，在现代电子设备设计中具备重要地位。无论是在电源管理、电机控制还是照明解决方案中，这款MOSFET都能作为理想的开关解决方案，帮助设计者实现高效、可靠的电路设计。随着科技的不断进步，30N06将继续作为电子元器件领域的重要一员，推动更多创新应用的实现。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
