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UMW 2SA73
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UMW 2SA73
- Type
- UMW
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- UMW
- Electronic Component
- 2SA73
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 PNP
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Electronic Component
- BM0230105278
- Operating Temperature
- 55℃~+150℃
- Transistor Type
- PNP
- Frequency(f T)
- 50MHz
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
2SA73 产品概述
一、概述
2SA73 是友台半导体（UMW）推出的一款小功率 PNP 双极结型晶体管，封装为 SOT-23，适用于便携设备及通用模拟电路中需要小电流、高电压兼容的场合。该器件在 150mA 集电极电流（Ic）和 50V 集-射极击穿电压（Vceo）条件下工作稳定，耗散功率为 200mW，适合音频前级、开关及放大电路中的低功耗设计。
二、主要电气参数
- 晶体管类型：PNP
- 最大集电极电流（Ic）：150 mA
- 集-射极击穿电压（Vceo）：50 V
- 最大耗散功率（Pd）：200 mW（封装限制，需考虑热管理）
- 直流电流增益（hFE）：120（典型，测量条件 1 mA，Vce = 6 V）
- 特征频率（fT）：50 MHz（适合中低频放大）
- 集电极截止电流（Icbo）：100 nA（典型）
- 集-射极饱和电压（VCE(sat)）：约 300 mV（饱和状态下，利于低压降开关）
- 射-基极反向击穿电压（Vebo）：5 V
- 工作温度范围：-55 ℃ 至 +150 ℃
三、主要特点与优势
- 高电压耐受：50V 的 Vceo 支持更宽的电源电压范围及更高的安全余量。
- 低功耗封装：SOT-23 小型封装兼顾空间节省与表面贴装工艺，适合移动终端与密集 PCB 布局。
- 良好放大性能：在小电流工作点时 hFE 较高（约120），便于实现电流放大与偏置稳定。
- 高频特性适中：fT≈50MHz，可胜任低至中频放大与开关应用。
- 低泄漏与低饱和压：Icbo 低，有助于高阻态保持；VCE(sat) 低可降低开关损耗。
四、典型应用
- 音频前置放大器与偏置电路
- 低电压开关、逻辑接口转换
- 电池供电便携设备的功率管理与驱动
- 温度及电流检测放大器节点
- 小信号放大与电平搬移电路
五、设计与使用建议
- 热管理：SOT-23 的 Pd 为 200 mW，实际使用时需在 PCB 设计中考虑铜箔散热和器件工作点的功率损耗，避免在高环境温度下超出热限制。
- 工作范围：避免在基极施加超过 Vebo（5 V）的反向电压；同时保持集电极电压低于 Vceo（50 V）以防击穿。
- 偏置与放大：建议在目标工作电流附近验证 hFE，以保证电路偏置稳定性；在需要精密放大时注意温度漂移影响。
- 饱和与开关：若用于开关应用，应根据实际开关电流和基极驱动条件评估 VCE(sat) 与开关损耗。
六、封装与订单信息
- 品牌：UMW（友台半导体）
- 型号：2SA73
- 封装：SOT-23（表面贴装）
- 适用场景：通用小信号放大、低功耗开关与便携设备电源管理
2SA73 以其在小型化封装下兼顾电压耐受与放大能力的特性，适合广泛的消费电子与工业控制小信号应用。在实际设计中建议配合电路仿真与样品测试，以确认在目标工作点下的热与电性能满足系统要求。
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