WMSIC Electronic Components

UMW MB6M(0.8A) MB6M

ModelMB6M(0.8A)
PackageMB-1
BrandUMW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UMW MB6M(0.8A)
Type
UMW
Minimum package
5000 盒

Technical parameters

Electronic Component
Electronic Component
Electronic Component
UMW
Electronic Component
MB6M(0.8A)
Electronic Component
1
Package
MB-1
Type
Electronic Component
Electronic Component
Bridge Rectifier
Electronic Component
0.24g
Electronic Component
1
Electronic Component
BM0230105281
Current
800mA
Current(Ir)
10uA
(Vf)
1.1V@500mA
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MB6M (0.8A) 产品概述

一、产品简介

MB6M 系列为单相整流桥,UMW(友台半导体)生产的 MB6M (0.8A) 为低功耗、小体积的整流器件,适用于一般电子设备的交流—直流整流转换。该型号在合理的工作电流范围内具有低正向压降、低反向漏电和良好的浪涌承受能力,适合对体积、成本和可靠性有综合要求的中低功率整流场合。

二、主要电气参数

  • 型号:MB6M (0.8A)(UMW / 友台半导体)
  • 类型:单相整流桥
  • 平均整流电流(Io):0.8 A(在规定散热条件下)
  • 正向压降(Vf):约 1.1 V @ 500 mA(单个二极管条件)
  • 直流反向耐压(Vr / Vrwm):600 V
  • 反向电流(Ir):10 μA @ 600 V
  • 非重复峰值浪涌电流(Ifsm):30 A(半波,典型 8.3 ms 半正弦)
  • 工作结温范围:-55 ℃ 至 +150 ℃
  • 封装:MB-1(塑封桥式封装)

以上参数为典型性能指标,实际电气特性应参照器件的详细数据手册并根据具体应用条件进行验证。

三、关键特性

  • 低正向压降:在中等电流范围内(例如 500 mA)单二极管约 1.1 V 的正向压降,有助于减少整流损耗与发热,提升系统效率。
  • 高峰值反向耐压:600 V 的耐压等级满足多数工业与民用高压输入场合的安全余量,适用于宽电压输入的电源设计。
  • 低反向漏电:在高耐压条件下仍能保持约 10 μA 的低漏电,有利于降低待机功耗及对精密电路的干扰。
  • 良好的浪涌承受能力:30 A 的单次浪涌电流能力可以吸收开启或短时冲击电流,提升瞬态可靠性。
  • 宽温度工作范围:-55 ℃ 至 +150 ℃,适应较严苛的环境温度变化。

四、典型应用

  • 开关电源初级整流、线性电源整流模块
  • 小功率适配器、充电器、家用电器控制板
  • LED 驱动与照明电源整流
  • 仪器仪表、测量设备的低功率供电
  • 监控、安防设备、低功率电机驱动的整流环节 MB6M 在这些场合以其体积小、成本低、可靠性高的优势,成为常用的整流选择。

五、封装与安装建议

  • 封装为 MB-1,四脚结构(两脚交流输入,正负输出各一);安装时请确认引脚标识与电路板丝印一致。
  • 散热考虑:MB-1 为塑封小体积封装,整流损耗会转化为结温上升。建议在 PCB 设计时增大正负输出铜箔面积或添加过孔形成散热通道,以保证在 Io=0.8 A 条件下器件结温在安全范围内。
  • 焊接工艺:遵循制造商的焊接温度曲线与回流规范,避免超时高温导致封装应力或可靠性下降。波峰/回流焊后建议做目检和必要的电气测试。

六、使用与维护建议

  • 过载及保护:尽量避免长期接近额定整流电流工作,必要时通过限流电阻、保险丝或电子保护电路防止异常浪涌损坏器件。
  • 温度管理:在高环境温度或紧凑结构中应降额使用(即降低允许的平均电流),并通过散热设计保证结温低于最大额定温度。
  • 浪涌评估:Ifsm 为非重复峰值浪涌能力,适合短时冲击。若应用存在反复或大幅度浪涌(如电机启动、重负载突变),应做更严格的浪涌分析或选用更高浪涌能力器件。
  • 储存与焊前处理:避免潮湿环境存放,按厂家建议进行干燥箱处理(若需要)并在保质期内使用。

七、典型电路参考(简述)

常见连接方式为全波桥式整流:将交流电源两端分别接到桥的两交流引脚(、),桥的正负输出作为直流电源输出。若需滤波则在输出端并联电解电容,配合后级稳压或滤波元件构成稳压电源或直流供电网络。

总结:MB6M (0.8A) 以其适中的额定电流、600 V 高耐压、低漏电与良好浪涌能力,适合多种中低功率整流用途。在设计中关注热管理与合理降额,可在保证可靠性的前提下实现经济、稳定的整流解决方案。若需更详细的电气曲线、封装尺寸或热阻参数,请参考 UMW(友台半导体)提供的完整数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.