WMSIC Electronic Components

UMW SPD9105W

ModelSPD9105W
PackageSOD-323
BrandUMW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UMW SPD9105W
Type
UMW
Minimum package
3000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
UMW
Electronic Component
SPD9105W
Electronic Component
1
Package
SOD-323
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.03g
Electronic Component
1
Cj- Capacitor
1pF
Electronic Component
BM0227354012
Operating Temperature
40℃~+85℃
Voltage
18V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
100pA
Voltage(VBR)
5.6V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SPD9105W 产品概述

SPD9105W 是 UMW(友台半导体)推出的一款面向低电平信号保护的瞬态抑制二极管(TVS),采用 SOD-323 超小封装设计。该器件针对常见的浪涌、静电放电(ESD)与电脉冲干扰提供可靠的瞬态抑制能力,特别适合对体积、寄生电容和漏电要求严格的信号线与接口保护场合。

一、主要特性与电气参数

  • 型号:SPD9105W
  • 品牌:UMW(友台半导体)
  • 封装:SOD-323(超小表贴封装)
  • 反向截止电压 (Vrwm):5 V
  • 击穿电压(典型):5.6 V
  • 钳位电压(Ipp 条件下):18 V
  • 峰值脉冲电流 (Ipp):20 A(8/20 μs 波形)
  • 反向电流 (Ir):100 pA(在 Vrwm 条件下极低漏电)
  • 结电容 (Cj):约 1 pF(低寄生电容,适合高速信号)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 符合标准:IEC 61000-4-2(ESD)、IEC 61000-4-4(EFT)、IEC 61000-4-5(浪涌)

二、功能优势与应用价值

  • 小封装、高密度布局:SOD-323 封装体积小,便于在空间受限的移动设备、便携式模块和高密度 PCB 上使用。
  • 低结电容(1 pF):对高速数据线(如 USB、UART、I²C、SPI、以太网等)造成的信号失真极小,能够在保持信号完整性的同时提供防护。
  • 低漏电流(100 pA):对低功耗与电池供电设备友好,不会显著增加待机功耗。
  • 强劲的脉冲吸收能力:在 8/20 μs 波形下可承受峰值 20 A 的浪涌,有效吸收来自外部的短时高能脉冲。
  • 符合 IEC 工业级防护标准:可通过 ESD、EFT 和浪涌等电磁兼容测试要求,提升系统抗扰度与可靠性。

适用场景示例:

  • USB、串口、I/O 接口及控制信号线保护
  • 消费类电子(平板、智能家居设备、手持终端)
  • 工业控制与测控模块(对温度要求 ≤ +85 ℃ 的场合)
  • 通信设备、网络终端及接口板卡

三、典型使用建议与电路接法

  • 接线方式:常见用法为将 SPD9105W 的阴极(通常标识为带)连接到被保护的信号线,阳极接地。当信号线上出现高于 Vrwm 的瞬态时,器件进入导通,钳位电压将瞬间限制到约 18 V,从而保护下游电路。
  • 布局要点:
    • 将器件尽量靠近受保护的接口或连接器放置,缩短与受保护节点之间的走线长度,以降低环路电感。
    • 器件接地端应尽可能直接回到系统地,避免通过长地线或共同地回流引入干扰。
    • 对于多层 PCB,优先使用连续地平面作为接地,以利于瞬态能量快速回流与散逸。
  • 并联注意事项:在需要更高能量吸收时,可按设计规范并联多个 TVS,但需注意分流不均衡可能带来的热应力问题与钳位电压的微小变化。

四、可靠性与封装信息

  • 封装形式 SOD-323 提供了良好的机械强度和焊接可靠性,适合常规无铅回流焊工艺。
  • 工作温度范围 -40 ℃ 至 +85 ℃,覆盖大部分民用及工业级应用温区,适合室内与一般室外设备;对要求更严苛温度(如汽车级)场合,应咨询UMW或选择对应等级器件。
  • 通过 IEC 61000 系列防护标准认证,便于产品通过整机 EMC 测试与认证。

五、选型与注意事项

  • 若系统工作电压或浪涌能量高于此器件规格,应选择 Vrwm 更高或 Ipp 能力更强的TVS型号。
  • 对于超高速差分信号(如高速 USB3、PCIe 等)需参考更低电容或差分专用 TVS 产品,以避免信号失真。
  • 评估时建议结合实际浪涌/ESD 能量、系统地网与封装布局进行仿真或实测验证,确保整机可靠性。

SPD9105W 以其超小封装、低电容与低漏电特点,提供对 5 V 级信号线的高效瞬态保护,是空间受限且对信号完整性要求高的电子设备的理想选择。如需样品、封装图或更详细的评价曲线,请联系 UMW(友台半导体)或其授权分销渠道获取 datasheet 与应用资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.