WMSIC Electronic Components

UMW HT7550S-2 HT7550S

ModelHT7550S-2
PackageSOT-23-5
BrandUMW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UMW HT7550S-2
Type
UMW
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
100mV
Electronic Component
UMW
Electronic Component
HT7550S-2
Electronic Component
1
Package
SOT-23-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
0g
Electronic Component
1
Electronic Component
BM0228789456
Operating Temperature
40℃~+85℃
Operating Voltage
30V
Output
Electronic Component
Output Voltage
5V
Output Current
100mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HT7550S-2 产品概述

一、简介

HT7550S-2 是友台(UMW)推出的一款固定输出线性稳压器(LDO),提供稳压输出 5.0V,最大输入电压可达 30V,最大输出电流 100mA。器件具有极低压差(典型 100mV@满载)和超低静态电流(Iq ≈ 3µA),工作温度范围为 -40℃ 到 +85℃,为单通道、正极输出,采用 SOT-23-5 小尺寸封装,适合对功耗、体积有严格要求的电源方案。

二、主要特性

  • 固定输出:5.0V,稳定可靠,便于系统设计;
  • 输入电压耐受高:最高可支持 30V 输入;
  • 输出电流:最高 100mA,满足常见控制器与外设供电需求;
  • 低压差:典型压差仅 100mV,有利于低差驱动场合;
  • 超低静态电流:Iq ≈ 3µA,适合电池供电与低功耗应用;
  • 宽温度范围:-40℃~+85℃,适应工业级应用;
  • 小尺寸封装:SOT-23-5,便于 PCB 布局与空间受限设计。

三、优势与适用场景

HT7550S-2 以低压差与低静态电流为突出优势,适合移动设备、便携式仪表、传感节点、低功耗 MCU/外设电源、工业控制模块及汽车电子(在满足规范前提下)等场合。高输入耐受能力使其可直接用于高电压输入或经过降压后的多路电源中。

四、典型电路与设计建议

  • 输入去耦:建议在 VIN 端靠近芯片放置 1µF~10µF 的陶瓷电容(X5R/X7R),抑制输入纹波与瞬态;
  • 输出电容:为确保稳压器稳定工作,建议在 VOUT 端配置 1µF~10µF 的低 ESR 陶瓷电容,具体值与 PCB 布局和负载特性相关;
  • 布局:VIN、VOUT、GND 电容尽量靠近器件引脚,地线采用完整地平面,减少环路面积;
  • 热设计:SOT-23-5 封装散热有限,持续接近 100mA 输出时应注意铜箔面积和散热,必要时增加散热铜皮或外壳散热路径;
  • 开关/控制:若需电源使能或顺序上电控制,请参照数据手册使用 EN 引脚(如器件带有该功能),并注意上电/关断速率对系统的影响。

五、封装与注意事项

HT7550S-2 采用 SOT-23-5 小封装,便于表面贴装。具体引脚定义、引脚排列、功能(如 EN、BY/ADJ 等)与绝对最大额定值请以正式数据手册为准。建议在实物验证中关注纹波、瞬态响应、热升以及在不同温度下的输出精度与稳定性。

六、选型建议

在选型时,应结合系统输入电压范围、最大负载电流、对压差与静态电流的要求,以及对输出精度和温漂的需求。HT7550S-2 在低功耗和低压差场合具优势;如需更高电流或更严格精度,可参考同类更高规格的 LDO 产品。最终设计前请下载并仔细阅读 HT7550S-2 的完整规格书与应用说明。

如需原理图示例、热阻数据或引脚图,请提供对接方式或直接参考厂商提供的器件规格书,以获得详尽参数与参考电路。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.