Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UMW PC817B
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UMW PC817B
- Type
- UMW
- Minimum package
- 5000 盒
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- UMW
- Electronic Component
- PC817B
- Electronic Component
- 1
- Package
- DIP-4
- Electronic Component
- Transistor Output Optocoupler
- Electronic Component
- 0.407g
- Electronic Component
- 1
- Electronic Component
- 3us
- Electronic Component
- BM0228055315
- Operating Temperature
- 30℃~+100℃
- Load Voltage
- 35V
- Type
- DC
- Output Current
- 50mA
- Output Type
- Photoelectric Transistor
- (Pd)
- 200mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PC817B 光电耦合器（UMW）产品概述
一、产品简介
PC817B（UMW/友台半导体）为高隔离度光电耦合器，封装形式为 DIP-4。器件以红外发光二极管驱动光电三极管实现电气隔离，输入类型为直流（DC），适用于低至中速信号隔离与逻辑电平传递。工作温度范围为 -30℃ 至 +100℃，隔离电压（Vrms）达 5kV，满足常见工业与消费类产品的安全隔离要求。
二、主要电气参数
- 隔离电压：5 kVrms（测试条件下）
- 电流传输比（CTR）：最小 50%，最大/饱和可达 600%（取决于 If、测量条件及老化）
- 正向压降 Vf：典型 1.2 V（If 参考值）
- 正向电流 If：最大 50 mA（建议连续工作时按额定值及散热条件选取）
- 直流反向耐压 Vr：6 V
- 输出类型：光电三极管，输出电流可达 50 mA，负载电压最高 35 V
- 集—射极饱和电压 VCE(sat)：约 100 mV（典型条件 If=20 mA，Ic=1 mA）
- 上升/下降时间：tr ≈ 4 μs，tf ≈ 3 μs（适合低中速开关应用）
- 总功耗 Pd：200 mW
三、应用场景与适用性
PC817B 适合用于：
- MCU 与高电压/噪声侧的信号隔离、开关量隔离；
- 开关电源反馈隔离、欠压/过流检测接口；
- 工业控制、仪表、继电器驱动与通信接口的电气隔离；
- 需要高增益（高 CTR）以减少 LED 驱动电流的场合。
由于上升/下降时间在微秒级，器件不适合高速数据总线（如 MHz 级）传输。
四、设计注意事项
- 输入侧：正向电流 If 不应长期超过额定值 50 mA，建议在连续工作中采用更低 If 并考虑散热与寿命。LED 反向电压不得超过 6 V。
- 输出侧：输出三极管为开集电极结构，务必使用上拉电阻，负载电压不得超过 35 V。若需要更快恢复，可并联斜率补偿或选择专用高速光耦。
- CTR 受温度、If 与老化影响较大，设计时预留裕量，避免仅以典型值计算。
- 隔离设计：5 kVrms 为测试耐压，实际产品应结合电路板爬电距离与爬弧要求，满足安全标准（如必要时做长时耐压验证）。
五、封装与采购
PC817B 采用 DIP-4 通孔封装，便于插装与焊接，适用于样机与批量生产。品牌为 UMW（友台半导体），采购时注意批次与出厂检验报告，必要时确认 CTR 曲线与寿命数据。总体而言，PC817B 在成本、隔离性能和增益之间具有良好平衡，适用于工业控制与电源隔离等广泛领域。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
