WMSIC Electronic Components

UMW BS170FTA

ModelBS170FTA
PackageSOT-23
BrandUMW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UMW BS170FTA
Type
UMW
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
UMW
Electronic Component
BS170FTA
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.038g
Electronic Component
1
Electronic Component
BM0228149259
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
300mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
60V
Capacitor(Ciss)
25pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BS170FTA 产品概述

一、简介

BS170FTA 是 UMW(友台半导体)推出的一款小功率增强型 N 沟 MOSFET,采用 SOT-23 表面贴装封装,适用于低电流开关与模拟开关场合。器件额定漏源电压 60V,连续漏极电流 250mA,器件工作温度范围宽(-55℃ 到 +150℃),适合工业级环境。

二、主要电气参数

  • 漏源电压 (Vdss):60V
  • 连续漏极电流 (Id):250mA
  • 导通电阻 (RDS(on)):2.8Ω @ Vgs=10V
  • 耗散功率 (Pd):300mW
  • 阈值电压 (Vgs(th)):约 2V @ Id=250µA
  • 栅极电荷量 (Qg):400pC @ Vgs=4.5V
  • 输入/输出/反向传输电容:Ciss=25pF,Coss=5pF,Crss=2pF

三、特性亮点与工程意义

  • 高耐压(60V),适合中低压系统的开关应用。
  • 小尺寸 SOT-23 封装,便于密集 PCB 布局与自动化贴装。
  • 相对较高的 RDS(on)(2.8Ω@10V)表明该器件适合小电流负载;在满载(250mA)下导通损耗仍然有限,但不适合高电流、低压降要求的场合。
  • 栅极电荷 Qg 在同类 SOT-23 器件中偏大,意味着驱动时需要考虑栅极驱动能力与开关速度的折衷。

四、应用场景

  • 小信号开关、低频通断(继电器驱动前级、指示灯驱动等)。
  • 低功耗电源管理与电平转换(注意 Vgs 驱动电压对 RDS(on) 的影响)。
  • 模拟开关或保护电路中的低电流路径。
  • 不建议用于高频大电流开关或作为主功率 MOSFET。

五、设计与使用建议

  • 驱动电压:RDS(on) 标称值在 Vgs=10V 时测得;若由 3.3V/5V MCU 直接驱动,导通阻抗会更高,应验证在目标 Vgs 下的导通损耗。
  • 栅极驱动:Qg 较大,若在较高开关频率下使用,应选用有足够瞬时驱动能力的驱动器或适当降低开关频率;使用门阻(10–100Ω)可抑制振铃并限制峰值电流。
  • 热管理:Pd=300mW,功耗敏感,PCB 链路应尽量减小串联电阻并提供合理散热铜箔;长时间运行或高环境温度时需考虑降额。
  • 电路保护:对于感性负载,需增加反向二极管或回流路径以防止瞬态过压;并在门极加下拉电阻避免悬浮导致误导通。
  • 布局要点:缩短漏—源走线,减小寄生电感;栅极走线避免与高电流回路平行以减少耦合噪声。

六、封装与采购

  • 封装:SOT-23,适合自动贴装生产。
  • 选型提示:在选用前请参照厂商完整数据手册确认引脚排列、典型曲线(RDS vs VGS、ID—VDS)及试验条件,必要时在目标电源/温度下做实测验证。

总结:BS170FTA 适合用于需 60V 耐压、低至中等电流的开关场合,体积小、易集成,但对栅极驱动能力与散热需给予重视。

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