WMSIC Electronic Components

UMW LESD3Z5.0CMT1G

ModelLESD3Z5.0CMT1G
PackageSOD-323
BrandUMW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UMW LESD3Z5.0CMT1G
Type
UMW
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
UMW
Electronic Component
LESD3Z5.0CMT1G
Electronic Component
1
Package
SOD-323
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.027g
Electronic Component
1
Cj- Capacitor
25pF
Voltage
5.6V
Electronic Component
BM0265612171
Operating Temperature
40℃~+125℃
Voltage
18.6V
Electronic Component
IEC 61000-4-4;IEC 61000-4-2
Current(Ir)
1uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LESD3Z5.0CMT1G 产品概述

一、产品简介

LESD3Z5.0CMT1G 是友台半导体(UMW)推出的一款 SOD-323 封装的单向 ESD 抑制二极管,针对 5V 工作电压系统提供高效的瞬态浪涌保护。器件在常态下具有低漏电和较小的结电容,能在电磁兼容(EMC)事件中迅速钳位,保护后端敏感电子元件不被过电压损坏。

二、主要性能参数

  • 反向截止电压 Vrwm:5 V(适用于典型 5V 系统)
  • 击穿电压 BV:5.6 V(触发保护动作)
  • 钳位电压 Vc:18.6 V(Ipp 条件下)
  • 峰值脉冲电流 Ipp:9.4 A @ 8/20 μs(一次性浪涌能力)
  • 反向电流 Ir:1 μA(在 Vrwm 下的典型泄漏)
  • 结电容 Cj:25 pF(对信号完整性影响可控)
  • 工作温度范围:-40 ℃ ~ +125 ℃
  • 符合 IEC61000-4-2(ESD)与 IEC61000-4-4(EFT)抗扰度要求

三、应用场景

  • USB、UART、I2C、SPI 等 5V 或低压接口的输入/输出端口保护
  • 移动设备、便携终端、智能家电、物联网模块的接口防护
  • 接口板、连接器与外部传感器线路的浪涌与静电防护
  • 工业控制与仪表中需要抗干扰保护的 I/O 端口

四、设计与布局建议

  • 器件应尽量贴近被保护的连接器或接口处布置,以缩短环路和降低感抗。
  • 将 SOD-323 的地端通过低阻抗接地平面或多条过孔(vias)直接回至系统接地,以便快速释放能量。
  • 避免在被保护信号线与 TVS 之间增加长导线或绕组,必要时可搭配小阻值串联电阻以分流能量并改善稳定性。
  • 对高速差分信号或高带宽应用,需评估 25 pF 的结电容对信号完整性的影响;对极高带宽(如 USB3.0)场景建议选用更低电容的专用器件。

五、可靠性与注意事项

  • 器件具备良好的温度范围(-40 ℃ ~ +125 ℃),适应常见工业与消费环境。
  • 峰值 8/20 μs 浪涌能力适合典型电源浪涌和静电放电事件,但重复大能量冲击会降低器件寿命,设计时应考虑保护器件的级联或增加限流元件以延长寿命。
  • 存储与焊接:按 SOD-323 表面贴装工艺及一般防潮回流焊要求处理与储存,避免超出推荐回流曲线导致封装应力或性能退化。

六、封装与选型提示

  • 封装:SOD-323,体积小,适合高密度 PCB 布局与批量自动贴装。
  • 若电路对结电容非常敏感或需要更高脉冲承受能力,可参考同系列或其他封装(如 SOD-523、SOD-826、SMB)替代型号。
  • 选型时根据系统最大工作电压、允许泄漏电流、信号带宽与浪涌能量等指标综合评估。

总结:LESD3Z5.0CMT1G 为 5V 系统提供了体积小、响应快且符合 IEC ESD/EFT 标准的保护方案,适用于各种消费类与工业应用的接口防护。合理的 PCB 布局与热/电设计能充分发挥其保护性能并延长系统可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.