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UMW 2SC3265
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UMW 2SC3265
- Type
- UMW
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- UMW
- Electronic Component
- 2SC3265
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Electronic Component
- BM0229956513
- Operating Temperature
- 55℃~+150℃
- Transistor Type
- NPN
- Frequency(f T)
- 120MHz
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
2SC3265 产品概述
一、概述
2SC3265 是由 UMW（友台半导体）推出的一款小功率 NPN 双极型晶体管，采用常用的 SOT-23 表面贴装封装。该器件面向对体积、成本与开关速度有较高要求的便携与消费类电子应用，兼顾开关与小信号放大能力，适合在受限功耗与空间环境中使用。
二、主要电气参数
- 晶体管类型：NPN（BJT）
- 集电极电流 Ic：800 mA（最大）
- 集—射击穿电压 Vceo：30 V
- 最大耗散功率 Pd：200 mW（芯片/封装热限制）
- 直流电流增益 hFE：100（典型，Ic=100 mA，VCE=1 V）
- 特征频率 fT：120 MHz（高频响应良好）
- 集电极截止电流 Icbo：100 nA（典型，低漏电）
- 集—射饱和电压 VCE(sat)：约 500 mV（饱和区）
- 射基极击穿电压 Vebo：5 V
- 工作温度范围：-55 ℃ ～ +150 ℃
三、产品特性与优势
- 小体积 SOT-23 封装，适合高密度 PCB 布局与自动化贴装。
- 在中等电流（几十到数百毫安）条件下，hFE 较高，便于作为中间放大级或驱动级使用。
- fT 达 120 MHz，意味着在 VHF 范围内仍有良好增益，适合高频开关和放大场合。
- 低 Icbo（约 100 nA）带来小的静态漏电，利于低功耗设计。
- 额定 Vceo 30 V，能承受常见的中低电压应用场景。
四、典型应用
- 小功率开关与负载驱动（继电器驱动、LED 驱动、继电器前驱）。
- 信号放大器（前置放大、功率放大器的驱动级）。
- 高频开关与脉冲电路（高频脉冲、PWM 驱动，需注意平均耗散功率）。
- 便携式与消费电子设备（要求体积小、成本低的场合）。
五、使用建议与注意事项
- 虽然 Ic 最高可达 800 mA，但封装耗散功率仅 200 mW，长期大电流工作时需确保 VCE very small（低压降）或采用脉冲工作模式，避免因过热导致损坏。
- 在设计中应考虑适当的电流限制（基极电阻、发射电阻或限流电路），防止进入深度饱和区或过流。
- 对于高频应用，应注意布局走线与寄生电容、电感的控制，缩短走线并在关键节点加旁路电容。
- 引脚排列与详细最大额定值、温升曲线请以厂家数据手册为准，常规封装的引脚分配与焊接规范需参考官方资料。
- 在苛刻环境或高温条件下，应评估热阻并采取必要散热或降额措施。
六、封装与采购信息
- 品牌：UMW（友台半导体）
- 封装：SOT-23（表面贴装）
- 推荐购买时查看最新的批次供货与规格书，以获得引脚图、典型工作曲线与可靠性测试数据。
总结：2SC3265 在小体积平台上提供了兼顾开关性能与频率响应的平衡特性，适用于多种低功耗、紧凑型电子设计。设计时应优先考虑热管理与电流限制，以发挥其最佳性能并保证可靠性。
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