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UMW SS36B UMW
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UMW UMW SS36B
- Type
- UMW
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- UMW
- Electronic Component
- UMW SS36B
- Electronic Component
- 1
- Package
- SMB(DO-214AA)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.195g
- Electronic Component
- 1
- Electronic Component
- BM0264490309
- Current
- 3A
- Diode
- 1
- Current(Ir)
- 200uA@60V
- (Vf)
- 750mV@3A
- Electronic Component
- 65℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
UMW SS36B 产品概述
一、产品简介
UMW（友台半导体）SS36B 是一款表面贴装的肖特基整流二极管，封装为 SMB（DO-214AA）。该器件采用金属-硅结构造，以多数载流子传导为主，适用于低压、高频功率整流与保护场合。塑料封装满足 UL 94V-0 阻燃等级，薄型设计并具备应力消除结构，利于自动贴装与回流焊工艺。
二、主要电气参数
- 正向整流电流（If）：3A（直流）
- 正向压降（Vf）：约 0.75V @ 3A
- 直流反向耐压（Vr）：60V
- 反向漏电流（Ir）：约 200µA @ 60V
- 非重复峰值浪涌电流（Ifsm）：80A（一次性冲击）
- 工作结温范围：-65℃ ~ +150℃
三、主要特性与优势
- 低正向压降：在高电流条件下保持较低功耗，提高系统效率并降低散热需求。
- 高电流能力：3A 连续整流，80A 峰值浪涌能力，适应启动与短时冲击条件。
- 低漏电流：在 60V 反向电压下漏电流约 200µA，适合低功耗系统。
- 表面贴装优化：薄型 SMB 封装带应力消除功能，兼容自动贴装与高速贴片工艺。
- 工艺可靠：封装材料满足 UL 94V-0，且引脚可耐 260℃ 焊接 10 秒，适合回流焊和波峰焊要求。
四、典型应用
- 开关电源（SMPS）输出整流与续流二极管
- 低压高频逆变器与电机驱动的续流保护
- 电源适配器、车载电子电源的整流与极性保护
- DC-DC 转换器、储能与充电设备中的整流与保护电路
五、封装与散热建议
SMB（DO-214AA）为窄薄型表贴封装，推荐合理的 PCB 散热铜皮与过孔布局以提高热扩散能力。在持续 3A 工作电流下应评估布局热阻并保留足够的铜面积或散热片以避免结温过高。贴片封装便于自动化生产，但在回流焊时请按推荐温度曲线控制焊接参数，器件可承受引脚 260℃、10 秒的短时高温。
六、使用注意事项
- 在高频大电流应用中，应关注结温上升和瞬态浪涌保护，必要时并联或选用更高额定电流器件。
- 反向电压接近 60V 时，漏电流会增加，应评估系统对漏电的容忍度。
- 储存与焊接时避免超出其工作结温范围和机械应力，确保长期可靠性。
UMW SS36B 以其低压降、高效率和表贴友好的封装，适合各种中低压功率整流与保护场合，为追求体积小、效率高的电源设计提供可靠选择。
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