WMSIC Electronic Components

UMW LTV816D

ModelLTV816D
PackageDIP-4
BrandUMW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UMW LTV816D
Type
UMW
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
UMW
Electronic Component
LTV816D
Electronic Component
1
Package
DIP-4
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.3g
Electronic Component
1
Electronic Component
3us
Electronic Component
BM0228055367
Operating Temperature
55℃~+110℃
Load Voltage
80V
Type
DC
Output Current
50mA
Output Type
Photoelectric Transistor
(Pd)
200mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LTV816D 晶体管输出光耦 产品概述(UMW / 友台半导体)

一、产品简介

LTV816D 为单路晶体管输出型光电耦合器,输入侧为直流 LED,输出侧为光电三极管,采用 DIP-4 封装。器件设计用于在电气隔离的两端传递数字或模拟信号,典型应用包括 MCU 隔离、开关电源反馈、工业控制信号隔离等。该型号由 UMW(友台半导体)供应,具有较高的隔离电压和宽广的电流传输比(CTR)范围,适合通用隔离场合。

二、主要规格(摘要)

  • 输入类型:DC(LED)
  • 输出类型:光电三极管(NPN)
  • 正向压降(Vf):约 1.2 V
  • 允许正向电流(If,最大):60 mA(脉冲或查阅数据手册)
  • 输出集电极电流(IC,最大):50 mA
  • 隔离耐压(Vrms):5 kV
  • 直流反向耐压(Vr):6 V
  • 负载电压(VCEO 或 Vce 最大):80 V
  • 输出通道数:1(单通道)
  • 集射极饱和电压(VCE(sat)):典型 ~100 mV(在低至中等工作电流范围时为参考值)
  • 上升/下降时间:tr ≈ 4 μs,tf ≈ 3 μs(典型)
  • 工作温度范围:-55 ℃ ~ +110 ℃
  • 电流传输比(CTR):最低 50%,最高可达 600%(随 IF、温度和测量条件变化)
  • 总功耗(Pd):200 mW(器件温升与功耗管理参考)

三、性能特点

  • 高隔离能力:5 kVrms 绝缘等级,适用于需要较高跨隔离保护的应用场合。
  • 宽 CTR 范围:CTR 最低 50%,高端可达 600%,便于在低驱动电流下获得较大输出电流,但同时意味着设计时需考虑 CTR 波动与最坏情况。
  • 低饱和压降:在合适偏置条件下,VCE(sat) 低,可减小输出端电压损耗与功耗。
  • 中等速度开关:上升/下降时间约 3–4 μs,适合一般控制和信号隔离,非高速数据链路用途。
  • 宽温度范围:-55 ℃ 至 +110 ℃,适应工业环境。

四、典型应用

  • MCU 与高压侧电路隔离(如继电器驱动、固态开关信号)
  • 开关电源的初/次级反馈隔离(注意带宽与响应速度)
  • 工业自动化与测控系统中的信号隔离
  • 电平移位与噪声敏感环境的接口保护

五、使用建议与热管理

  • 设计时以最差 CTR(最低 50%)进行计算,保证在最不利条件下仍满足输出电平与加载要求。
  • 输入侧限流:按公式 R = (Vin - Vf) / If 选择限流电阻。例如 Vin=5V,目标 If=10 mA,则 R ≈ (5 - 1.2) / 0.01 ≈ 380 Ω,常用 390 Ω。
  • 输出侧上拉:若 VCC=5V,目标 IC=1 mA,则上拉电阻约 R = (VCC - VCE(sat)) / IC ≈ (5 - 0.1) / 0.001 ≈ 4.9 kΩ,可选 4.7 kΩ/5.1 kΩ。
  • 功率与散热:器件总功耗 Pd = 200 mW,输出侧与输入侧产生的功耗需累计考虑,长时间高电流工作应降额使用并保证良好散热。
  • 电压与电流极限:输出最大承受 80 V 负载电压,最大输出电流 50 mA,不适合直接驱动大功率负载或继电器线圈(除非外接驱动器或放大级)。

六、选型注意与可靠性

  • CTR 变化受温度与光衰影响,长期工作应预留裕量并在量产前进行产测分档。
  • 若需更快响应或更稳定 CTR,可考虑选用高速型或带开集电路(Open-collector)规格更贴合的型号。
  • 确认具体封装引脚排列、绝对最大额定值及典型电气特性,请以厂家最新版数据手册为准。对于需满足安全法规(如高压隔离、医疗或家电应用)的设计,参考相关安全标准并进行认证测试。

总结:LTV816D(UMW / 友台)为单通道晶体管输出光耦,适合一般工业与电子隔离应用,特点是高隔离电压、宽 CTR 范围与中等开关速度。设计时请基于最差 CTR、功耗限制与环境温度进行余量设计,并参照原厂数据手册完成最终验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.