WMSIC Electronic Components

UMW S8050

ModelS8050
PackageSOT-23
BrandUMW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UMW S8050
Type
UMW
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
UMW
Electronic Component
S8050
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0229305117
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Frequency(f T)
150MHz
Power Dissipation(Pd)
300mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S8050 产品概述

一、产品简介

S8050 是一款通用 NPN 双极型晶体管,由友台半导体(UMW)生产,适用于低功耗开关和放大场合。器件额定集电极电流可达 500mA,集电极-发射极最大电压为 25V,耗散功率 300mW,常见于 SOT-23 小封装,便于表面贴装与高密度电路板设计。

二、主要特性

  • 直流电流增益 hFE ≈ 120(测定条件 50mA、VCE=1V),在中低电流下具有良好放大能力。
  • 集电极饱和电压 VCE(sat) ≈ 600mV(典型值),在开关饱和状态下压降较小。
  • 特征频率 fT ≈ 150MHz,适合音频及低中频放大与驱动应用。
  • 极限工作温度范围 -55℃ 至 +150℃,适合较宽温度工况。
  • 极小漏电流:集电极截止电流 Icbo ≤ 100nA,降低静态泄漏损耗。
  • 基-发射击穿电压 Vebo ≈ 5V;集-射击穿电压 Vceo ≈ 25V。

三、电气参数(重要规格)

  • 晶体管类型:NPN
  • 最大集电极电流 Ic:500mA
  • 最大耗散功率 Pd:300mW(注意封装和升温限制)
  • VCE(sat):约 600mV(导通饱和时)
  • Icbo:≤ 100nA
  • fT:约 150MHz

四、封装与引脚

器件常见封装为 SOT-23,三脚排列适合自动贴片生产。请参考厂家数据手册获取确切引脚顺序与引脚功能图,以保证焊接和电路连接无误。

五、典型应用

  • 低功耗开关与驱动(继电器、指示灯、信号电平转换)
  • 小信号放大器(音频前级、传感器信号调理)
  • 电源管理辅助电路与接口缓冲
  • 消费电子、通信设备和工业控制系统中的通用放大、开关单元

六、使用建议与注意事项

  • 由于 Pd 仅 300mW,须考虑 PCB 散热设计和封装热阻,避免在高集电极电流和高环境温度下长期接近极限功耗。
  • 当作为开关使用时,合理选择基极限流电阻以确保进入饱和同时避免基极过流。
  • 注意 Vebo(约 5V),基-发间反向电压不可超过规格以防损坏。
  • 在高频应用中,请参考小信号模型并做好寄生电容、走线布局的控制。

七、可靠性与存储

器件工作温度范围宽(-55℃~+150℃),适合多种工况。元器件应按厂家推荐的防潮与回流焊工艺存储与处理,避免焊接热损伤和静电敏感问题。

如需原厂完整 Datasheet、引脚图或典型电路示例,请提供需求,我可协助检索与解读。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.