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UMW PESD15VS2UT
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UMW PESD15VS2UT
- Type
- UMW
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- UMW
- Electronic Component
- PESD15VS2UT
- Electronic Component
- 1
- Package
- SOT-23
- Type
- ESD
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Cj- Capacitor
- 50pF
- Electronic Component
- BM0227625239
- Voltage
- 35V
- Electronic Component
- IEC 61000-4-4；IEC 61000-4-5；IEC 61000-4-2
- Current(Ir)
- 500nA
- Voltage(VBR)
- 17.6V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PESD15VS2UT 产品概述
一、产品简介
PESD15VS2UT 是 UMW（友台半导体）推出的一款面向静电放电与浪涌防护的 TVS/ESD 器件，封装为 SOT-23，适用于对 I/O 接口、信号线及电源线进行瞬态过压保护。器件主要规格包括：反向工作电压 Vrwm = 15V，击穿电压 Vbr ≈ 17.6V，钳位电压 Vc ≈ 35V（在 8/20µs 浪涌下），峰值脉冲功率 Ppp = 350W（8/20µs），峰值脉冲电流 Ipp = 10A（8/20µs），结电容 Cj = 50pF，反向漏电流 Ir = 500nA。器件通过 IEC 61000-4-2/4-4/4-5 等静电与浪涌抗干扰标准认证，适合工业与消费类电子的抗扰设计需求。
二、主要特性与优势
- 高频响应快、瞬态吸收能力强：350W（8/20µs）峰值能量与 10A 峰值电流，能有效抑制常见的静电和雷击感应浪涌。
- 低泄漏与稳定击穿点：Vrwm 15V 及 500nA 的低反向电流，适合对偏置敏感的电路。
- 中等结电容（50pF）：在多数数字与模拟接口中可以接受；对极高速差分接口需在系统级评估。
- 工业级兼容性：满足 IEC 61000-4 系列防护等级，便于满足产品 EMC 设计要求。
- SOT-23 小封装：便于表面贴装、自动化生产和空间受限 PCB 布局。
三、典型应用场景
- USB、串口、CAN、RS-485 等通信接口保护（需按接口电压与带宽评估）。
- 电源回路的瞬态抑制，尤其是 15V 型电源轨的本地防护。
- 工业控制器、消费电子、测试设备等要求 IEC-级别静电/浪涌防护的终端产品。
四、设计与布局建议
- 器件应尽量靠近被保护的接口或引脚贴装，走线最短以降低寄生感应。
- 提供良好接地面（地平面）并在保护器与地之间保持低阻抗回流路径。
- 对于对延迟与带宽敏感的高速信号，建议评估 50pF 电容对信号完整性的影响，必要时考虑并联阻抗或选择低容型保护器件。
- SOT-23 封装热容有限，大电流冲击时需在 PCB 散热与保护策略上做好配合（如串联阻抗、限流元件等）。
五、使用注意事项
- 持续工作电压不应超过 Vrwm（15V），长期超压可能导致漏流或失效。
- 钳位电压 35V 是在 8/20µs 条件下的典型值，实际系统中若电流更大或波形不同，钳制水平会变化。
- 在选择用于差分线或对称保护时，确认器件的单/双向特性与接法以免影响信号极性。
六、型号与采购
型号：PESD15VS2UT；品牌：UMW（友台半导体）；封装：SOT-23。建议在样片验证中复核器件在目标应用下的钳位行为、结电容对信号的影响及热稳定性，以确保设计满足 EMC 与可靠性要求。
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