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UMW SS54
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UMW SS54
- Type
- UMW
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- UMW
- Electronic Component
- SS54
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0g
- Electronic Component
- 1
- Electronic Component
- BM0228218882
- Current
- 5A
- Diode
- Electronic Component
- Current(Ir)
- 1mA@40V
- (Vf)
- 550mV@5A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS54 肖特基二极管（UMW / 友台半导体）产品概述
一、产品简介
SS54 为独立式肖特基整流二极管，UMW（友台半导体）生产，封装为 SMA (DO-214AC)。该器件面向中高电流整流与开关电源、续流保护等场景，具有低正向压降与高速恢复特性，适用于空间受限且要求高效率的电源设计。
二、主要参数
- 顶名型号：SS54
- 封装：SMA (DO-214AC)
- 直流整流电流（Io）：5 A
- 直流反向耐压（Vr）：40 V
- 正向压降（Vf）：约0.55–0.60 V @ 5 A（典型值）
- 反向漏电流（Ir）：1 mA @ 40 V（典型测量条件）
- 非重复峰值浪涌电流（Ifsm）：150 A
- 工作结温范围：-55 ℃ 至 +150 ℃
三、特点与优势
- 低正向压降：在大电流工况下显著降低功耗与发热，提高整机效率。
- 低反向恢复特性：肖特基结构无显著反向恢复电荷，适合高频开关应用，减少开关损耗与电磁干扰。
- 良好冲击承受能力：150 A 峰值浪涌电流支持启动或短时过载场景。
- 宽温度范围：-55℃—150℃ 结温范围，适应工业级工作温度要求。
四、封装与热性能
SMA（DO-214AC）封装兼顾散热与占板面积，适合波峰/回流焊工艺。尽管封装有一定散热能力，长期工作电流建议做热设计与散热管理：保持结温在安全范围内（常规设计宜低于125℃），在高环境温度或连续5 A 负载下应配合散热铜箔或散热器以控制结温。
五、典型应用
- 开关电源（SMPS）整流与续流二极管
- 汽车电子电源保护（在符合温升与漏电要求下）
- 电池充放电保护与整流电路
- 逆变器、DC-DC 转换模块、车载充电器等高频电源系统
六、安装与可靠性注意事项
- 焊接建议遵循厂家回流/波峰焊温度曲线，避免过高峰值温度与过长热暴露时间。
- 反向漏电流随温度显著上升，设计时需考虑额定环境温度下的漏电与热稳定性。
- 若电路可能出现反向高压尖峰，建议增设抑制元件（TVS、电阻或RC 抑制网络）以保护肖特基结不被瞬态过压损坏。
- 在长期高应力或汽车等严苛环境应用，建议进行可靠性验证（热循环、机械振动、湿热测试等）。
七、选型建议
- 若系统工作电压或浪涌高于标称值，应选用更高 Vr 或更大 Ifsm 余量的型号。
- 对效率要求更高或电流更大的场合，可考虑更低 Vf 或更大封装的肖特基器件。
- 在温度或漏电敏感应用中，重点比对 Ir 随温度的上升曲线与热阻参数，必要时联系供应商获取详细器件曲线与测试条件。
如需完整电气特性曲线、热阻（RθJC/RθJA）、典型正向/反向特性图或封装尺寸与回流焊工艺建议，请提供您的具体应用工况或索取 UMW 官方数据手册以获取精确参数。
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