WMSIC Electronic Components

UMW AO4459

ModelAO4459
PackageSOP-8
BrandUMW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UMW AO4459
Type
UMW
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
UMW
Electronic Component
AO4459
Electronic Component
1
Package
SOP-8
Electronic Component
1 P
Electronic Component
MOSFET
Electronic Component
0.19g
Electronic Component
1
Electronic Component
BM0227324872
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
3.1W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
30V
Capacitor(Ciss)
520pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AO4459 产品概述

一、产品简介

AO4459 是友台半导体(UMW)出品的表面贴装型 P 沟道 MOSFET,额定漏源电压 Vdss 为 30V,连续漏极电流 Id 为 6.5A(Ta),在 Ta 条件下耗散功率 Pd 为 3.1W。器件采用 SOP-8 封装,适合中等功率、高侧开关与反向保护场合。

二、主要电气参数

  • 漏源电压 Vdss:30V
  • 连续漏极电流 Id:6.5A(Ta)
  • 导通电阻 RDS(on):33mΩ @ VGS = 10V(标称)
  • 阈值电压 Vgs(th):约 1.5V(以绝对值计,P 沟道器件在负向栅压下导通,测试电流 250µA)
  • 总栅电荷 Qg:9.2nC @ 10V
  • 输入电容 Ciss:520pF;反向传输电容 Crss:65pF;输出电容 Coss:100pF
  • 工作温度:-55℃ 至 +150℃

三、特性解读与设计要点

  1. 导通特性:33mΩ 的 RDS(on)(在 VGS = 10V 下)表明器件在充分栅压驱动时损耗较低,适用于功率损耗敏感的高侧负载切换。
  2. 栅极驱动:标称 RDS(on) 在 |VGS| = 10V 条件下测得。对于 P 沟道器件,需对栅极施加相对于源极的负向电压(约 -10V)以达到该导通电阻,设计时须确认驱动电平与电源轨关系。
  3. 开关损耗:Qg = 9.2nC 和 Crss = 65pF 表明在高频切换时栅极驱动损耗与米勒效应不可忽视,驱动器能力与开关速率需要配合选择。
  4. 热管理:SOP-8 封装下 Pd = 3.1W(Ta),需在 PCB 设计中预留充足焊盘铜箔和散热通孔以维持温升在安全范围。

四、典型应用场景

  • 电池供电设备的高侧开关与负载断开
  • 便携式设备的反向电流防护与极性保护
  • 电源管理电路中的软启动与电源选择(power path)
  • 低至中等功率的开关与保护电路

五、使用与注意事项

  • 切勿超过 Vds = 30V 的最大额定值,注意瞬态尖峰。
  • 避免栅源过压/反向应力,必要时加上栅极保护器件(TVS 或限流电阻)。
  • 在高频切换场合,考虑增加门极电阻以抑制振铃并降低 EMI。
  • 采用适当的 PCB 散热设计(加大铜箔面积、布置热孔)以优化 Pd 使用条件。
  • 注意静电防护,器件对静电敏感。

六、总结

AO4459 以 30V 额定、电流能力 6.5A、较低的 RDS(on) 和 SOP-8 小型封装,为高侧开关、反向保护与电源管理方案提供了体积小、性能平衡的解决方案。针对具体系统,请参考完整数据手册并根据实际工况进行热与驱动设计优化。若需更详细的浪涌、动态特性与布局建议,建议向厂家索取完整规格书。

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