WMSIC Electronic Components

UMW GBLC03CI-LF-T7 GBLC03CI

ModelGBLC03CI-LF-T7
PackageSOD-323
BrandUMW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UMW GBLC03CI-LF-T7
Type
UMW
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
UMW
Electronic Component
GBLC03CI-LF-T7
Electronic Component
1
Package
SOD-323
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.028g
Electronic Component
1
Cj- Capacitor
0.6pF
Electronic Component
BM0229464351
Voltage
7V
Electronic Component
IEC 61000-4-4;IEC 61000-4-2
Current(Ir)
5uA
Voltage(VBR)
4V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GBLC03CI-LF-T7 产品概述

一、产品简介

GBLC03CI-LF-T7 是友台半导体(UMW)推出的一款表面贴装型 TVS 二极管,面向高速数据线与低电压电源线路的瞬态过压与静电放电(ESD)保护。器件为双向结构,低结电容、快速响应,适用于对信号完整性要求高且需通过 IEC 级抗扰度认证的场合。

二、主要参数

  • 钳位电压(VC):7V
  • 击穿电压(Vbr):4V
  • 反向截止电压(Vrwm):3V
  • 峰值脉冲功率(Ppp):250W @ 8/20µs
  • 描述:7V 夹子 1A(8/20µs) Ipp TVS 二极管(表面贴装)
  • 防护等级:符合 IEC 61000-4-2(ESD)、IEC 61000-4-4(EFT)
  • 结电容(Cj):约 0.6 pF(适合高速信号)
  • 极性:双向
  • 反向电流(Ir):典型 5 µA
  • 封装:SOD-323(小型贴片,便于自动贴装与高密度 PCB 布局)
  • 品牌:UMW(友台半导体)

三、产品亮点

  • 低结电容(0.6 pF),对高速数据线(USB、HDMI、LVDS 等)影响小,保证信号完整性。
  • 双向设计,无需外加极性判断,方便用于差分或双向保护。
  • 满足 IEC 61000-4-2/4 等抗扰度等级,能有效吸收静电与快速瞬态脉冲。
  • SOD-323 小尺寸封装,适合空间受限的消费电子与通信终端产品。

四、典型应用

  • 手机、平板、笔记本等便携设备的 I/O 或信号接口保护。
  • USB、串口、通讯接口的 ESD 与浪涌防护。
  • 摄像头模组、传感器接口以及其他对信号完整性要求高的线路。
  • 工业控制与汽车电子中对瞬态抗扰度有要求的低压侧保护(需核对系统电压与器件 Vrwm)。

五、使用建议与注意事项

  • Vrwm=3V,适合保护 3V 及以下工作电压系统;高于此电压的系统请慎重选型或并联其他保护方案。
  • 虽然 Ppp=250W(8/20µs)表征器件抗浪涌能力较强,但该功率为瞬态脉冲条件下指标,长期或重复高能脉冲会导致器件热应力,请在 PCB 设计上保证良好散热与合理安全裕量。
  • 结电容低,适合放在靠近受保护器件的一侧,尽量缩短保护器件与被保护线之间的走线。
  • 建议在保护点到接地的走线短且粗,避免地回路阻抗影响放电路径。
  • 焊接与回流工艺请遵循厂商推荐的温度曲线,避免超温或长时间加热造成封装/性能劣化。

六、封装与可靠性

SOD-323 小封装利于高密度布局与自动化贴装。器件已通过 IEC 61000-4-2/4 等抗扰度验证,适合要求工业级或消费级 ESD 保护的场景。针对不同应用,请在样机阶段进行实际系统级 ESD 与浪涌测试以确认整机性能。

七、典型接线提示

  • 双向 TVS 可直接并接在两端信号线上(如数据线对地或对线),对称放置即可生效。
  • 对高速差分信号,建议在每一根信号线上各放置一个 TVS,或采用针对差分的保护方案,避免引入不对称影响。

八、选型要点

  • 若系统工作电压接近或高于 3V,请核对 Vrwm 与系统稳压要求,必要时选择更高 Vrwm 的 TVS。
  • 对于极端重复脉冲环境,应关注能量吸收能力与热管理设计,必要时采用并联或更大功率等级的保护器件。

总结:GBLC03CI-LF-T7 以其低电容、双向保护与符合 IEC 抗扰度的性能,适合对高速信号与低压线路要求较高的场景。合理的 PCB 布局与热管理能最大化器件保护效果与可靠性。若需更详细的典型波形、回流曲线或封装尺寸图,请提供进一步需求以便补充资料。

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