WMSIC Electronic Components

UMW NTR4503NT1G

ModelNTR4503NT1G
PackageSOT-23
BrandUMW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UMW NTR4503NT1G
Type
UMW
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
UMW
Electronic Component
NTR4503NT1G
Electronic Component
1
Package
SOT-23
Electronic Component
MOSFET
Electronic Component
0g
Electronic Component
1
Electronic Component
BM0228532382
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
730mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
30V
Capacitor(Ciss)
135pF
Gate (Qg)
3.6nC@10V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NTR4503NT1G 产品概述

一、概述

NTR4503NT1G 是友台半导体(UMW)推出的一款30V级低压降功率MOSFET,采用SOT-23小封装设计,针对便携设备和空间受限的功率管理场景优化。器件兼顾了较低的导通电阻与适中的栅极电荷,适用于开关频率不很高但对效率和封装面积有要求的应用。

二、主要电气参数

  • 漏源电压 Vdss:30V
  • 连续漏极电流 Id:2.5A
  • 导通电阻 RDS(on):85mΩ @ Vgs=10V, Id=2.5A
  • 阈值电压 Vgs(th):1V(典型)
  • 耗散功率 Pd:730mW(封装及环境依赖)
  • 总栅极电荷 Qg:3.6nC @ Vgs=10V
  • 输入电容 Ciss:135pF
  • 反向传输电容 Crss:15pF @ 15V
  • 工作温度范围:-55℃ ~ +150℃

三、主要特性与优势

  • 封装小巧(SOT-23),适合高密度PCB布局;
  • Vdss=30V 适用于多数单电池或低压电源系统;
  • 典型 RDS(on)=85mΩ 在10V栅压下能提供较好的导通损耗控制;
  • Qg 3.6nC 和 Ciss/Crss 的组合在门极驱动能量与开关损耗之间取得平衡,方便驱动电路设计;
  • 宽温工作范围适合工业级与汽车电子周边应用(需根据具体场景确认认证)。

四、典型应用场景

  • 系统电源开关、负载开/关控制;
  • 低压降电源分配与保护电路;
  • DC-DC 转换器(作为同步整流或切换管,适用于中低频场合);
  • 便携式设备和物联网终端的电源管理;
  • 小电流马达驱动、信号切换与反向保护(需结合电路和热设计评估)。

五、封装与热管理建议

SOT-23 小封装带来封装热阻相对较高的特性,器件Pd 730mW 为典型散热能力,实际可用功率受PCB铜箔面积和环境温度影响显著。设计建议:

  • 在PCB上为漏极/散热焊盘留足够铜箔面积并采用多层接地/散热层;
  • 在连续较大电流工作时进行热仿真与实测,必要时选择并联器件或更大封装;
  • 考虑布局时将热源分散,避免热堆积影响周边元件。

六、选型与使用注意事项

  • 若电路工作在高开关频率或需要极低导通损耗,应比较更低RDS(on)或更大封装的MOSFET;
  • 设计驱动电路时以10V栅压为参考点,注意门极驱动能量与开关损耗平衡;
  • 注意器件制造商关于最大栅-源电压、瞬态浪涌电流与绝对极限的完整规格,避免超限应力;
  • 在有反向恢复或高应力脉冲条件下,参考Crss与Coss对电路性能的影响并做好抑制。

七、总结

NTR4503NT1G 在30V/2.5A级别中提供了体积小、驱动要求适中并兼顾效率的选择,尤其适合对封装面积敏感且电流在数安培范围内的应用。合理的PCB散热设计与驱动方案能充分发挥其性能,若需更高电流或更低RDS(on),建议按应用场景向上选型或并联使用。

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