WMSIC Electronic Components

UMW FQD13N10LTM

ModelFQD13N10LTM
PackageTO-252
BrandUMW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UMW FQD13N10LTM
Type
TO-252
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
UMW
Electronic Component
FQD13N10LTM
Electronic Component
1
Package
TO-252
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0g
Electronic Component
1
Electronic Component
BM0229921900
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
40W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
100V
Capacitor(Ciss)
400pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FQD13N10LTM 产品概述

一、产品简介

FQD13N10LTM 为 UMW(友台半导体)推出的一款 N 沟道功率 MOSFET,耐压 Vdss=100V,连续漏极电流 Id=10A,封装为 TO-252(DPAK),适合中等功率开关与功率管理场合。器件具备较低的导通电阻与适中的开关电荷,适用于降压转换、同步整流、负载开关及电机驱动等应用。

二、主要电气参数

  • 漏源电压(Vdss):100V
  • 连续漏极电流(Id):10A
  • 导通电阻(RDS(on)):142mΩ @ Vgs=10V
  • 阈值电压(Vgs(th)):2V @ 250µA
  • 总栅极电荷(Qg):12nC
  • 输入电容(Ciss):400pF;反向传输电容(Crss):20pF;输出电容(Coss):95pF
  • 耗散功率(Pd):40W
  • 工作结温范围:-55℃ ~ +150℃

三、主要特性与优势

  • 100V 耐压满足工业与汽车外围高电压余量的需求。
  • RDS(on) 142mΩ 在 10V 门极驱动下提供较低导通损耗,适合中等电流场合。
  • Qg=12nC 与 Ciss=400pF 带来适中的驱动负担,栅极驱动器要求一般,易与常见驱动 IC 匹配。
  • TO-252 封装利于表面贴装,便于自动化生产与 PCB 散热设计。

四、应用建议

  • 开关电源(降压/升压转换器)与同步整流。
  • 电机驱动的低侧开关或保护开关。
  • 继电器/电磁阀替代的电子负载开关。
  • 通用功率管理与逆变前端整流。

五、热管理与 PCB 设计要点

  • 器件 Pd=40W 为理想耗散值,实际散热依赖 PCB 铜箔面积与散热片。建议在 TO-252 底部和底层布置足够铜箔并配合热导孔(vias)将热量传导至内层/背面散热铜皮。
  • 保持栅极走线短且阻抗可控,减少寄生感性与环路面积,以降低开关振铃与 EMI。
  • 在源端和漏端附近放置去耦电容,靠近器件的布置可以抑制瞬态电压尖峰。
  • 对于高 dV/dt 场合,可并联合适的 RC 或 TVS 做缓冲与保护。

六、使用注意与选型建议

  • RDS(on) 标称值在 Vgs=10V 条件下测得,若使用逻辑电平(如 5V 或更低)需验证实际导通电阻与损耗;需要更低导通电阻时应选用更低 mΩ 级别器件。
  • Qg=12nC 意味着在高频切换时栅极驱动功耗不可忽视,需评估驱动器能力与热量。
  • 遵循 ESD 操作规范,管脚敏感,存储与搬运注意防静电。
  • 建议工作结温留有裕度,长期可靠性以 Tj ≤125℃ 为佳,极限不超过 150℃。

FQD13N10LTM 在 100V/10A 级别的应用中提供了良好的性价比与通用性,适合需要中等导通损耗与耐压的功率开关场景。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.