WMSIC Electronic Components

UMW AO4828

ModelAO4828
PackageSOP-8
BrandUMW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UMW AO4828
Type
UMW
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
UMW
Electronic Component
AO4828
Electronic Component
1
Package
SOP-8
Electronic Component
2 N
Electronic Component
MOSFET
Electronic Component
0.16g
Electronic Component
1
Electronic Component
BM0228149257
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
2.1W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
60V
Capacitor(Ciss)
1.92nF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AO4828 场效应管(MOSFET)产品概述

一、概述

AO4828 是友台半导体(UMW)推出的一款双通道 N 沟道功率 MOSFET,封装为 SOP-8,面向中等电压、中等电流的开关和功率管理应用。器件单通道额定漏源电压为 60V,连续漏极电流为 6.5A,导通电阻 RDS(on) 在 VGS=10V 时为 30mΩ。该器件兼顾较低的导通损耗与适中的开关特性,适用于成本与性能要求均衡的电源和驱动场景。

二、关键参数(摘要)

  • 通道类型:双 N 沟道(2×N-channel)
  • 漏源电压 VDSS:60V
  • 连续漏极电流 ID:6.5A(单通道)
  • 导通电阻 RDS(on):30mΩ @ VGS = 10V
  • 耗散功率 PD:2.1W(SOP-8 封装,需考虑散热)
  • 阈值电压 VGS(th):1.5V @ ID=250µA
  • 总栅极电荷 Qg:50nC @ VGS = 10V
  • 输入电容 Ciss:1.92nF
  • 输出电容 Coss:155pF
  • 反向传输电容 Crss(Crss):116pF
  • 工作温度范围:-55 ℃ 至 +150 ℃
  • 封装:SOP-8
  • 品牌:UMW(友台半导体)

三、性能亮点

  • 适中电压等级(60V):适合 12V、24V 或更高电压系统的功率开关使用。
  • 低导通电阻(30mΩ@10V):在适当的栅压下可实现较低的导通损耗,提升效率。
  • 双通道封装(SOP-8):节省 PCB 面积,便于实现对称电路(例如 H 桥或双路开关)。
  • 宽工作温度范围:适合工业级或车规前端温度要求(-55 ℃ ~ +150 ℃)。
  • 平衡的开关特性:Qg=50nC、Ciss=1.92nF,兼顾驱动能耗与开关速度,适配常见门极驱动器。

四、典型应用场景

  • DC-DC 转换器(降压/升压转换器)
  • 电机驱动(小功率直流电机或驱动桥臂)
  • 负载开关与电源管理(板级电源分配、背光驱动)
  • LED 驱动器与功率放大器
  • 通用功率开关:继电器替代、低侧或高侧驱动(配合适当驱动电路)

五、设计考虑与实用建议

  1. 栅极驱动

    • RDS(on) 标定在 VGS=10V,若要获得标称低阻值,应使用接近 10V 的栅压;若仅用 5V 门驱,导通阻抗会显著上升,影响损耗。
    • Qg=50nC 表明驱动电荷量处于中等水平,选用门极驱动器时需考虑其驱动电流能力与开关频率带来的功耗(Pg = Qg × Vdrive × fSW)。
  2. 开关损耗与寄生电容

    • Ciss、Coss、Crss 等电容值会影响开关过渡过程和回灌现象(Miller effect)。Crss(116pF)对关断过程的影响需通过合适的门极阻尼和栅极驱动策略来控制,避免振铃和 EMI。
    • 若工作在较高开关频率,应评估器件的开关损耗并考虑软开关或外加箝位/缓冲电路。
  3. 热管理

    • 封装为 SOP-8 且 PD 标称为 2.1W,实际散热能力依赖 PCB 铜箔面积、热过孔与环境条件。在持续大电流工作下需进行热仿真或增加散热铜箔,以避免结温超限导致性能退化。
    • 并联使用时需注意电流均分与热交互效应,推荐小心布局并在必要时做电流匹配设计。
  4. 布局与 EMC

    • 高速开关时注意回流路径最短、门极与源极地线分离、添加合适的去耦元件和栅极阻尼(序列电阻或 RC 抑制)以降低 EMI 和振荡风险。
    • 对于半桥拓扑,建议在高侧与低侧之间的快速电流环上尽量减小环路面积。

六、选型建议

  • 若系统工作电压在 60V 以下且需要双通道封装以节省空间,AO4828 是性价比较高的选择。
  • 需要低 RDS(on) 且以 5V 门驱为主时,应评估是否能接受较高的导通损耗,或选择专门标注 5V 逻辑电平低阻型 MOSFET。
  • 对于高频、高效率应用,关注 Qg 与 Coss/Crss 的影响,必要时比较同类器件的开关损耗与导通损耗折衷。

七、总结

AO4828 以 60V 耐压、6.5A 电流能力和 30mΩ 的低导通电阻在 SOP-8 双通道封装中提供了良好的电源开关解决方案,适合多种中等功率开关和驱动场景。在实际设计中,需特别关注栅极驱动电压、驱动能耗、开关损耗与散热设计,以发挥器件最佳性能。若需更详细的引脚定义、典型应用电路或完整电气特性曲线,建议参考厂方数据手册或联系 UMW 获取最新资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.