Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UMW BAT54C
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UMW BAT54C
- Type
- UMW
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- UMW
- Electronic Component
- BAT54C
- Electronic Component
- 1
- Package
- SOT-23-3
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Electronic Component
- BM0264752004
- Current
- 200mA
- Diode
- 1
- Current(Ir)
- 2uA@25V
- (Vf)
- 1V@100mA
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAT54C 产品概述
一、产品简介
UMW（友台半导体）出品的 BAT54C 是一款双路肖特基二极管，采用 1 对共阴极（Common Cathode）配置，SOT-23-3 表面贴装封装。器件以低正向压降和快速恢复特性为主要优势，适合便携式电源、电平整流与混合信号保护等应用场景。
二、主要参数
- 二极管配置：1 对共阴极（Common Cathode）
- 正向压降：Vf = 1.0 V @ If = 100 mA（典型）
- 整流电流（最大）：Io = 200 mA（DC）
- 非重复峰值浪涌电流：Ifsm = 600 mA（单次冲击）
- 直流反向耐压：Vr = 30 V
- 反向电流：Ir = 2 µA @ Vr = 25 V（25℃）
- 封装：SOT-23-3
- 品牌：UMW（友台半导体）
三、关键特性与优势
- 低正向压降：肖特基结构使得正向电压明显低于普通硅整流二极管，减小功耗与发热，提升效率。
- 低反向漏电：在 25 V 时反向电流仅约 2 µA，适用于低功耗电路与待机场景。
- 快速响应：肖特基二极管无 PN 结存储电荷，开关速度快，适合高频整流与快速保护用途。
- 小型封装：SOT-23-3 占板面积小，适合空间受限的移动设备与消费电子。
四、典型应用
- 电源输入防反接与隔离（OR-ing）
- 低压整流与续流（开关电源二次侧、二次整流）
- TTL/CMOS 电平整流与电平转换补偿
- 输入保护与钳位（混合信号接口）
- 指示灯驱动及小功率负载保护（在额定电流范围内）
五、封装与焊接建议
BAT54C 采用 SOT-23-3 小型塑封，建议按常规 SMD 回流焊工艺进行贴装；为保证可靠焊点与散热，推荐合理的 PCB 焊盘设计与地铜/散热铜箔。焊接后建议避免长时间高温环境以降低老化和漏电增加的风险。装配与测试时注意防静电（ESD）保护。
六、使用注意事项
- 不要超过额定直流整流电流 200 mA，且应考虑环境温度的降额；若有脉冲或浪涌，注意 Ifsm 不超过 600 mA（单次）。
- 反向电压最大 30 V，超过此值会导致击穿或永久损伤。
- 为延长寿命并保证性能，避免在高结温下长时间工作，必要时在 PCB 上提供热散路径。
- 并联使用需谨慎，器件间正向压降差异可能导致不均流。
七、订购信息与型号示例
建议型号命名示例：UMW-BAT54C-SOT23（具体型号与带卷装/散装选项请向供应商确认）。如需样片、卷带或交期信息，请联系友台半导体授权分销渠道或技术支持以获得最新数据手册与 PCB 封装建议图。
如需获取更详细的电气特性曲线、温度特性或 PCB 推荐焊盘，请告知应用场景，我可提供针对性的选型与布板建议。
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