WMSIC Electronic Components

UMW LTV-356T-C

ModelLTV-356T-C
PackageSOP-4
BrandUMW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UMW LTV-356T-C
Type
UMW
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
UMW
Electronic Component
LTV-356T-C
Electronic Component
1
Package
SOP-4
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.2g
Electronic Component
1
Electronic Component
3us
Electronic Component
BM0228532364
Operating Temperature
55℃~+110℃
Load Voltage
80V
Type
DC
Output Current
50mA
Output Type
Photoelectric Transistor
(Pd)
200mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LTV-356T-C 产品概述

一、产品简介

LTV-356T-C 是友台半导体(UMW)出品的一款双路光电耦合器(SOP-4 封装),输入为直流驱动的发光二极管,输出采用光电三极管。器件用于实现电气隔离与信号传输,适合工业控制、通信接口、电源管理及微控制器隔离等场合。该器件在保证高隔离电压同时兼顾较高的传输效率与响应速度。

二、主要电气参数

  • 输入(LED):正向压降 Vf ≈ 1.2V,额定正向电流 If 最高 50mA,反向耐压 Vr = 6V。
  • 输出(光电三极管):最大集电极电流约 50mA,允许负载电压(VCEO)最高 80V。
  • 电流传输比(CTR):最小 50%,典型/最大可达 600%。
  • 集-射极饱和电压 VCE(sat):约 100mV(在典型工作点下),适合低压降开关应用。
  • 隔离耐压:输出与输入端之间可达 3.75 kVrms。
  • 响应时间:上升时间 tr ≈ 4 μs,下降时间 tf ≈ 3 μs。
  • 功耗与温度:总功耗 Pd = 200 mW,工作温度范围 -55℃~+110℃。

三、关键特性

  • 高电压隔离(3.75 kVrms),可满足多数工业与医疗级隔离需求。
  • 宽 CTR 范围(50%–600%),既适用于低电流驱动也可在高灵敏度需求下工作。
  • 低饱和压降(≈100 mV),在开关状态下能显著降低功耗与发热。
  • 中等响应速度(几微秒级),适合大多数数字信号隔离和低速串行通信。

四、典型应用场景

  • MCU 与高压侧电路的逻辑隔离。
  • 开关电源(SMPS)反馈与隔离检测。
  • 工业控制器、PLC 输入输出隔离。
  • 仪表、测量设备与通信接口保护。

五、封装与使用注意

  • 封装形式:SOP-4,适合表面贴装工艺。
  • 使用时注意 LED 极性与光电三极管极性,不可反向施加超过 Vr 的电压。
  • 推荐按系统需求计算串联限流电阻以保护 LED(根据 Vf 与 If 选择)。
  • 在焊接与回流工艺中应遵循厂方温度曲线及静电防护规范,避免超温或机械应力导致封装损伤。
  • 设计 PCB 时注意保持输入输出间的爬电与间隙距离,以发挥隔离性能。

六、可靠性与环境适应

LTV-356T-C 设计适应宽温度范围(-55℃ 到 +110℃),总功耗与热管理需在 PCB 设计中予以考虑。器件适用于需要长期稳定隔离与低功耗传输的工业电子系统,建议在关键应用中参考厂方的应用笔记与可靠性数据进行设计验证。

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