WMSIC Electronic Components

UMW LD1117-2.5 LD1117

ModelLD1117-2.5
PackageSOT-223
BrandUMW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UMW LD1117-2.5
Type
UMW
Minimum package
2500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
1.3V@(1A)
Electronic Component
UMW
Electronic Component
0.003%Vout
Electronic Component
LD1117-2.5
Electronic Component
1
Package
SOT-223
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.25g
Electronic Component
1
Features
Electronic Component
Electronic Component
BM0228273243
Operating Temperature
40℃~+125℃
Operating Voltage
18V
Output
Electronic Component
Output Voltage
2.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LD1117-2.5 产品概述

一、产品简介

UMW(友台半导体)出品的 LD1117-2.5 是一款固定输出 2.5V 的线性稳压器(LDO),采用 SOT-223 封装,面向需稳定低噪声电源的嵌入式和消费类电子应用。器件集成过流保护功能,工作温度范围宽(-40℃ 至 +125℃),适用于工业级与商用场景。

二、主要参数与特性

  • 输出电压:固定 2.5V
  • 最大输出电流:1A
  • 最大输入电压:18V(典型工作电压参考)
  • 压降(Dropout):1.3V @ 1A
  • 静态电流(Iq):5mA
  • 输出极性:正极、单通道
  • 过流保护:内置限流(实现短路及过载保护)
  • 工作温度:-40℃ ~ +125℃
  • PSRR:60dB @ 120Hz(优良的电源纹波抑制)
  • 输出噪声:约 0.003% · Vout(约 75µV [email protected])
  • 封装:SOT-223

三、典型应用

适用于对噪声、纹波要求较高的模拟电路和数字系统电源,如:低频精密放大器供电、ADC/DAC 参考电源、MCU 外设电源、通信设备局部稳压、工业控制模块等。

四、设计与使用注意事项

  • 功耗与散热:线性稳压器的功耗 Pd = (Vin − Vout) × Iout。若 Vin = 18V、Vout = 2.5V、Iout = 1A,则 Pd ≈ 15.5W,SOT-223 无法在无额外散热条件下安全耗散此热量。建议尽量降低输入电压或在大电流/大压差场合采用开关降压前级以减小热损耗,并通过 PCB 大面积铜箔散热或外接散热片。
  • 输出电容与稳定性:为保证环路稳定性和瞬态响应,建议在输出端使用低 ESR 的电解/钽电容或固态电容(典型值 10µF ~ 22µF),并在输入端放置 1µF~10µF 的去耦电容以抑制输入纹波与瞬态。具体电容类型应按应用在板上验证。
  • 启动与过载行为:硬件上应考虑上电顺序和短路情况的保护设计,利用串联熔断器或限流电阻作为二次保护。器件内部限流保护可在短路时限制电流,但长时间高功耗仍需注意热失效。

五、封装与焊接建议

SOT-223 提供较好的成本与散热平衡,焊接时建议在 PCB 布局上为引脚对应铜箔设计散热通道并增加焊盘面积,尤其是连接地与芯片底部散热路径处;推荐在布局中预留热 vias 以增强散热至内层或底层铜箔。

六、选型与采购建议

在选型时如期望在高 Vin 与高 Iout 条件下长时间工作,优先评估散热方案或选用更适合的大功率封装/开关预稳压方案。UMW LD1117-2.5 适合中低压差、小至中等电流且对噪声与 PSRR 有要求的应用。订购时请注明封装 SOT-223 及必要的温度等级,以确保满足系统可靠性需求。

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