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UMW BC846B
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UMW BC846B
- Type
- UMW
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- UMW
- Electronic Component
- BC846B
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Electronic Component
- BM0228218881
- Operating Temperature
- 65℃~+150℃
- Transistor Type
- NPN
- Frequency(f T)
- 100MHz
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BC846B 产品概述（UMW·友台半导体）
一、产品简介
BC846B 为 UMW（友台半导体）出品的一款通用 NPN 小功率晶体管，封装为 SOT-23，适用于便携式与板载低功耗信号处理场合。器件具备高电压耐受与较高电流增益的平衡特性，便于在放大与开关两类电路中应用。
二、主要参数与特性
- 晶体管类型：NPN
- 最大集电极电流 Ic：100 mA
- 集射极击穿电压 Vceo：65 V
- 功耗 Pd（总耗散）：200 mW（SOT-23 封装）
- 直流电流增益 hFE：典型 200 @ Ic=2 mA, VCE=5 V
- 特征频率 fT：约 100 MHz（典型）
- 集电极截止电流 Icbo：典型 100 nA（低漏电流）
- 集射极饱和电压 VCE(sat)：约 500 mV（在适当基极驱动下）
- 射基极反向击穿电压 Vebo：6 V
- 工作温度范围：-65 ℃ ~ +150 ℃
三、电气特性要点
BC846B 在小信号区表现优良：hFE 在低电流（约 2 mA）时可达 200，便于构建高增益前置放大器；fT≈100 MHz 支持高频小信号放大与缓冲。低 Icbo（100 nA）利于低电流、低泄漏电路设计。需要注意功耗限制：在最大 Ic=100 mA 下，如果 VCE 较大，会超出 Pd（200 mW）——例如 100 mA 时允许的最大 VCE 仅为 Pd/Ic = 2 V，因此高电流工作应限制 VCE 或改用更大功耗封装。
四、封装与散热建议
SOT-23 小型封装适合密集贴装电路，但热阻较高。推荐在 PCB 上为器件的引脚和焊盘配置足够的铜箔面积（散热地/散热线）并采用多层板接地铜箔以提高功耗承载能力。实际设计中应计算功耗并确保结温不超过规定的工作温度上限。
五、典型应用
- 小信号放大器、前置放大与音频放大低阶级
- 开关驱动（低功率继电器、指示 LED 驱动）
- 电平转换、缓冲、采样与保持前级
- 射频前端的低噪声放大器（在fT限制内）
- 电池供电便携设备中的通用开关/放大单元
六、使用建议与注意事项
- 避免在 VBE 反向超过 6 V 的情况，以防损伤基极-发射极结。
- 在需要饱和导通时，保证足够的基极驱动电流以达到约 500 mV 的 VCE(sat) 典型值。
- 对于持续高电流或高 VCE 应用，应降低工作电流或采用更高功耗器件。
- 设计 PCB 时扩大焊盘和铜箔面积，并考虑热仿真验证结温。
- 储存与焊接过程中注意 ESD 与热应力保护，遵循厂家焊接温度曲线。
BC846B 在通用电子设计中提供了高增益、较高耐压与低漏电流的良好组合，适合多种小信号与低功耗开关应用。但在高功耗或持续大电流场合，应重点关注热管理与安全工作区限制。
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