WMSIC Electronic Components

UMW MB6S

ModelMB6S
PackageSOP-4
BrandUMW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UMW MB6S
Type
UMW
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
UMW
Electronic Component
MB6S
Electronic Component
1
Package
SOP-4
Type
Electronic Component
Electronic Component
Bridge Rectifier
Electronic Component
0.217g
Electronic Component
1
Electronic Component
BM0228090804
Current
800mA
Current(Ir)
10uA
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating (Vr)
600V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MB6S 产品概述

一、产品简介

MB6S 是 UMW(友台半导体)提供的一款单相整流桥,封装为 SOP-4,适用于低功率交流到直流的整流场合。器件采用硅整流结构,针对小型电源、家电控制板及其他通用电子设备提供稳定的全波整流功能,体积小、成本低、易于线路板安装。

二、主要电气参数

  • 整流电流(平均):800 mA,适合轻载至中等载流场合。
  • 正向压降(Vf):1.0 V @ 0.5 A,低正向压降有利于减少整流损耗和发热。
  • 非重复峰值浪涌电流(Ifsm):30 A(单次浪涌),可承受开机或电容充电时的瞬态冲击。
  • 直流反向耐压(Vr):600 V,适用于高压交流输入或需要较高反向耐压的系统。
  • 反向电流(Ir):10 µA(典型条件),高温下漏电会增加,应在设计中考虑。
  • 类型:单相整流桥(全波桥式),封装 SOP-4。

以上参数为典型/额定值,具体使用时请参照 UMW 正式数据手册。

三、典型应用场景

  • 小功率开关电源的输入整流与滤波。
  • 家电控制板、照明驱动、仪表仪器的低功耗整流。
  • 信号源及隔离小电源的桥式整流模块。
  • 需要高反向耐压且电流需求不大的应用场合。

四、封装与引脚信息

SOP-4 封装便于表面贴装生产,典型引脚排列为两脚为交流输入(~),另外两脚为正、负输出(+,-)。在实际设计中务必参考厂商封装图与焊盘建议,保证焊接可靠性与良好的散热路径。

五、设计注意事项与可靠性建议

  • 热管理:尽管整流电流标称为 800 mA,但连续使用时需考虑正向压降产生的功耗与 PCB 铜箔散热面积,必要时加大铜箔或使用散热件以免过热。
  • 漏电与温度:反向电流随温度上升显著增加,若在高温环境或高阻负载中使用,应留足裕量。
  • 浪涌保护:Ifsm 为 30 A,可承受短时浪涌,但频繁大浪涌会降低寿命。对大电容充电的输入,建议配置 NTC 或限流电阻、浪涌吸收器(如 TVS)以保护器件。
  • 焊接与工艺:遵循厂商推荐的回流焊曲线,避免过长高温暴露导致封装应力或内部性能退化。
  • EMC 与滤波:整流后配合适当的滤波电容和 EMI 元件,减少开关和整流带来的干扰。

六、替代件与选型建议

在选型时可根据电流等级、正向压降和反向耐压比较同类桥式整流器;若需更低 Vf 或更高电流,可考虑 Schottky 桥或大电流封装;若需更高浪涌能力或更低漏电,可选择额定更高的型号。最终确认前,建议对照 UMW 的完整数据手册和PCBA的热仿真结果进行验证。

备注:以上为基于给定参数的专业概述,实际设计请结合厂商完整数据手册和样片测试结果。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.