WMSIC Electronic Components

UMW SD12

ModelSD12
PackageSOD-323
BrandUMW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UMW SD12
Type
UMW
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
UMW
Electronic Component
SD12
Electronic Component
1
Package
SOD-323
Electronic Component
Electronic Component
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.028g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
130pF
Electronic Component
BM0264554816
Voltage
19V;32V
Electronic Component
IEC 61000-4-4;IEC 61000-4-2
Current(Ir)
1uA
Voltage(VBR)
13.3V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SD12 单向瞬态电压抑制器(SOD-323)产品概述

一、产品概述

SD12 是友台半导体(UMW)推出的一款单路单向 TVS 二极管,采用 SOD-323 小封装,专为移动设备和基于微处理器的电子设备的 I/O 线与电源线提供瞬态过压保护。器件工作电压覆盖 3.3V 至 36V 范围,能有效抑制来自静电放电(ESD)和电快速瞬变(EFT)的破坏性脉冲。

二、主要性能特点

  • 单向结构,适用于需要单向钳位的电源或信号保护。
  • IEC61000-4-2(ESD)性能:空气放电/接触放电均达 ±30kV。
  • IEC61000-4-4(EFT)性能:5/50ns 脉冲可承受 40A。
  • 峰值脉冲功率 350W(8/20µs),具备强大的瞬态能量吸收能力。
  • 低反向漏电流:Ir ≈ 1µA(在 Vrwm 条件下)。
  • 结电容 Cj ≈ 130pF,适中结容需在高速信号场景中评估。
  • 典型击穿电压 VBR ≈ 13.3V,标称反向工作电压 Vrwm = 12V。
  • 典型钳位电压 19V(8/20µs),在不同测试条件下峰值钳位可达 32V。

三、电气参数要点

  • 反向截止电压(Vrwm):12V
  • 击穿电压(VBR):约 13.3V
  • 钳位电压:典型 19V(8/20µs),极限条件下至 32V
  • 峰值脉冲功率:350W @ 8/20µs
  • 反向漏电流:1µA(典型)
  • 结电容:130pF(典型)
    以上参数为典型值或在特定测试条件下测得,选用时请参照最新器件规格书以获取完整电气特性曲线。

四、典型应用场景

  • 手机与配件的充电口、电源输入及数据 I/O 线保护。
  • 基于微处理器的控制板、传感器接口与通信端口的瞬态抑制。
  • 工业与消费类电子中需要单路高能量吸收、低漏电的保护位置。
    注意:由于结电容为 130pF,若用于高速差分信号(如高速 USB/HDMI),需评估对信号完整性的影响;更适合电源线或低速信号保护。

五、封装与可靠性

  • 封装:SOD-323,体积小,便于贴片装配,适合空间受限的移动终端与便携设备。
  • 符合 IEC61000 系列抗扰度标准,通过 ESD 与 EFT 实测,可靠性满足一般消费与工业级防护要求。
  • 推荐靠近被保护端口布置,最短走线以降低寄生感抗与提升吸收效率。

六、选型与使用建议

  • 若被保护线路工作电压在 3.3V 或 5V,且需要对接口进行高能量 ESD 抑制,SD12 为合适选择;对更高工作电压(接近 36V)亦可使用但需注意钳位水平。
  • 对高频信号线(>100MHz)应慎用或评估并行串联阻抗匹配方案,以避免结电容导致的信号畸变。
  • PCB 布局:将 SD12 靠近输入端或连接器,使用宽地平面并缩短回流路径;对于高能量环境考虑增加串联阻抗或熔断保护。
  • 焊接与储存按通用 SMD 规范执行,避免重复高温回流导致性能退化。

如需器件完整数据手册、典型测试曲线或样片采购信息,请提供联系方式或向友台半导体(UMW)授权分销渠道查询。

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