WMSIC Electronic Components

UMW TL431 (1%) TL431

ModelTL431(1%)
PackageSOT-23
BrandUMW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UMW TL431(1%)
Type
UMW
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
UMW
Electronic Component
TL431(1%)
Electronic Component
1
Package
SOT-23
Electronic Component
Voltage Reference IC
Electronic Component
±1%
Electronic Component
0.033g
Electronic Component
1
Electronic Component
BM0264554910
Operating Temperature
40℃~+85℃
Output Current
100mA
Output Type
Electronic Component
Electronic Component
Electronic Component
Electronic Component
3000
Current
250uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TL431 (1%) — 可编程精密分流基准 概述

一、产品简介

UMW(友台半导体)出品的TL431 (1%) 是一款精度高、可调输出的三端可编程分流基准/误差放大器,采用SOT-23小封装,工作温度范围宽(-40℃~+85℃)。器件核心为2.495V 精密参考,初始精度±1%,可作为可调稳压、基准源和反馈误差放大器使用,最大阴极(输出)电流达100mA,最小阴极维持调节电流仅250µA,适合电池供电与低功耗系统应用。

二、主要特性

  • 输出类型:可调(可编程分流基准)
  • 参考电压:Vref ≈ 2.495V(典型)
  • 精度:±1%(初始)
  • 输出/阴极电流:最大 100mA,最小调节电流 250µA(保持调节)
  • 工作温度:-40℃~+85℃
  • 封装:SOT-23(小型化、易于贴片生产)
  • 品牌:UMW(友台半导体)

三、典型电气公式与设计要点

  • 输出电压设定(外接分压器): Vout = Vref × (1 + R1/R2) + Iref × R1 其中Vref为内部参考(≈2.495V),Iref为参考端电流。设计时通常令Iref×R1对误差的影响可忽略,因此优先保证R1、R2阻值不过大以减小误差与噪声。
  • 工作电流建议:器件在≥250µA下可维持调节,但为获得更佳热稳定性与响应性,建议典型工作阴极电流在1mA~20mA范围内,根据功耗与热限度调整。
  • 功耗与热管理:SOT-23封装受限于封装散热,实际允许的最大功耗取决于电压降与电流。设计时应保证结温不超过额定值,并注意PCB散热设计。

四、典型应用

  • 精密可调稳压源与参考电压源
  • 开关电源误差放大器与光耦反馈回路
  • 低压差线性稳压(与外部功率晶体管配合)
  • 过压/欠压检测、阈值比较与电池管理
  • 精密电流源或可编程限流电路

五、布局与使用建议

  • REF引脚对噪声敏感,必要时在REF与阴极间接入小电容(几pF至几十nF)以改善瞬态与噪声,但需验证系统稳定性(避免振荡)。
  • 分压电阻阻值建议不超过约100kΩ以抑制Iref对精度的影响并降低噪声。
  • SOT-23封装建议短走线、预留散热铜箔,必要时增加邻近地铜以改善热阻与稳定性。
  • 高电压差与高电流场合注意功耗计算与结温控制,可考虑使用外部通流晶体管分担功耗。

六、选型与可靠性

选择时请确认UMW提供的完整数据手册,关注温度漂移、长期漂移、瞬态响应与最小维持电流等参数。若应用对温漂或高温精度有严格要求,可参考厂方的详细温度特性曲线与失配规范。对于量产应用,建议与UMW工程支持沟通样品可靠性测试与封装识别。

如需,我可以根据您的目标电压、输入电源与负载条件,给出具体的外接电阻计算、样机电路和PCB布局建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.