WMSIC Electronic Components

Vishay MMB02070C1002FB200 Resistor MMB02070C1002FB200

ModelMMB02070C1002FB200
PackageMELF-0207
BrandVISHAY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
VISHAY MMB02070C1002FB200
Type
VISHAY
Minimum package
2000 圆盘

Technical parameters

Power
1W
Electronic Component
Electronic Component
Electronic Component
VISHAY
Electronic Component
MMB02070C1002FB200
Electronic Component
1
Package
MELF-0207
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.115g
Electronic Component
10kΩ
Electronic Component
1
Electronic Component
BM0231044544
Operating Temperature
55℃~+155℃
Operating Voltage
350V
Electronic Component
±50ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMB02070C1002FB200 产品概述

一、产品简介

MMB02070C1002FB200 为 VISHAY(威世)品牌的薄膜贴片电阻,封装形式为 MELF-0207,阻值 10 kΩ,精度 ±1%,额定功率 1 W。该器件采用金属化薄膜工艺,具有优良的长期稳定性与低噪声特性,适用于要求高精度与高可靠性的电子线路。

二、主要技术参数

  • 阻值:10 kΩ
  • 精度:±1%
  • 额定功率:1 W
  • 最高工作电压:350 V
  • 温度系数(TCR):±50 ppm/℃
  • 工作温度范围:-55 ℃ ~ +155 ℃
  • 封装:MELF-0207(玻璃化金属圆柱贴片)
  • 品牌:VISHAY(威世)

三、产品特性

  • 高精度与低漂移:±1% 精度配合 ±50 ppm/℃ 的低温漂,适合精密测量与参考电阻应用。
  • 良好功率处理能力:1 W 的额定功率在小型化封装中提供可靠热性能(具体热降额请参照厂方数据手册)。
  • 宽温区稳定性:-55 ℃ 至 +155 ℃ 的工作温度区间,适合工业级与航天/军工类温度苛刻环境。
  • 抗噪声与长期可靠性:薄膜工艺带来低电噪声与优秀的长期阻值稳定性。
  • MELF 封装优势:圆柱形贴片结构便于高温循环与冲击耐受,同时有利于热量沿体积散出。

四、典型应用

  • 精密电压分压与参考电路
  • 仪器仪表与数据采集前端
  • 工业控制与传感器接口
  • 电源管理与高压偏置网络(最高工作电压 350 V)
  • 通信设备与医疗电子(需符合相应认证时参考具体规格)

五、封装与焊接注意事项

  • MELF-0207 为无引脚圆柱体贴片,建议使用适配的丝网模板与回流焊工艺进行安装。
  • 为确保散热与可靠性,焊盘设计应兼顾热扩散路径,必要时参考 VISHAY 的推荐焊盘与回流曲线。
  • 装配时注意避免过大的机械冲击与侧向力,MELF 封装在手工操作中易发生滚动或损伤。
  • 清洗与助焊剂选择应符合薄膜元件的化学兼容性,强腐蚀性溶剂应避免长期接触。

六、可靠性与品质保证

  • 薄膜工艺和严格的制造控制确保良好的温度循环与湿热可靠性。
  • 建议在关键设计中按 VISHAY 数据手册进行热降额与寿命评估,根据实际环境温度调整允许功耗。
  • 采购与使用时可要求厂方提供批次检验报告与可追溯性文件,保障关键应用的质量要求。

七、选型与使用建议

  • 若电路工作电压接近 350 V 或环境温度偏高,应留有安全裕度并进行热仿真验证。
  • 对于极低温漂或更高功率需求,可比较同系列或其他封装(如功率更高的专用电阻)进行权衡。
  • 生产导入前建议完成 PCB 样板的回流可焊性测试与长期老化测试,以验证装配工艺与使用寿命。

如需详细的机械尺寸、焊盘建议、回流曲线或可靠性试验数据,请参阅 VISHAY 官方数据手册或联系供应商获取完整技术文件。

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